Ultra Durable™ 3
  Leading the Motherboard Industry Inside and Out!
GIGABYTE Ultra Durable™ 3 + Smart 6™ Technology
Copper Cooled Quality
  GIGABYTE Ultra Durable™ 3 Technology
GIGABYTE Ultra Durable™ 3 series motherboards once again lead the motherboard industry for the highest quality and most innovative motherboard design. Featuring the industry's first consumer desktop motherboard design to introduce 2 ounces of copper for both the Power and Ground layers, GIGABYTE Ultra Durable™ 3 motherboards deliver dramatically lower system temperature, improved energy efficiency and enhanced stability for overclocking.
Ferrite Core
50,000 hrs. Japanese Solid Capacitor
Lower RDS(on)
2 oz Copper
Inner Layer
Signal Layer
Power /
Ground layer
Ground layer
Signal Layer
  CPU VRM Temperature measurements under system setup with water-cooler block and CPU running at 100% loading
      The benefits of 2 oz Copper PCB design
Better Power
2X Lower
Lower EMI Better ESD
Lower Temperature
Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. In fact, GIGABYTE Ultra Durable™ 3 motherboards are able to deliver twice as cool working temperatures than traditional motherboards.
Infra Red CPU VRM Thermal Diagram
 * CPU VRM Temperature measurements under CPU running at 100% loading.
2X Lower Impedance
In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable™ 3 motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality, providing better system stability and allowing greater margins for overclocking.
2 oz Copper PCB
1 oz Copper PCB
Impedance Ω
  Lower is better
  Better Overclocking
Delivering native support for DDR3 2200+ and DDR2 memory up to 1366+ MHz, GIGABYTE Ultra Durable™ 3 series motherboards allow users to reach higher memory frequency at lower voltage; achieving higher memory performance with lower power consumption to run even the most memory intensive applications such as high-definition video and 3D games with ease.
Lower EMI
A good PCB circuit layout is the key of controlling EMI emission. GIGABYTE's Ultra Durable™ 3 design features 2 ounces of copper for ground layers, improves signal integrity and lowers EMI emissions through a very effective ground plane.

* Electromagnetic interference (or EMI) is an unwanted disturbance signals that affects surrounding electronic devices.
Lower is better
Better Power Efficiency
Increasing the thickness of the motherboard PCB Power layer by using 2 ounces of Copper allows the electric current to flow with less resistance, enabling more power efficient circuits with lower power loss and less heat generated.
Better ESD Protection
2 ounces of Copper for the Ground layer of the motherboard PCB allows for a more efficient Electro-Static Discharge (ESD) of up to 10%. This helps to better protect the motherboard components against damage caused by static electricity.
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