X299X DESIGNARE 10G

12 Phases IR Digital VRM Solution with 70A Power Stage

To unleash the full power of the new Intel 18 core CPU, the motherboard demands un-precedented strong power solution. GIGABYTE R&Ds selects the best components and never stop pursuing the highest overclock performance. That makes X299X DESIGNARE 10G an un-beatable motherboard in the market.

• 70A IR Power Stage for each vCore Phase
• High current capacity MOSFET
• Lower temperature
• Server level reliability

X299X DESIGNARE 10G motherboard adopts an all IR digital CPU power design which includes a digital PWM Controller with Power Stage MOSFET and is capable of providing 70A of power from each phase, for a total of incredible 840A. This 100% digital controller and additional 8+8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new 18-core 10th Gen Intel^® Core™ X processors.

Re-engineered Thermal Solution

With CPU draws bigger power than ever. Thermal solution are pushed to a limit. X299X DESIGNARE 10G features full Board Thermal Protection with Fins-Array and 6mm Balancing Heat Pipes . In order to place full Board Thermal Protection , we try hard to clear a path for it. Furthers, fins-Array Heatsink which increases the heat dissipation area by 300% compared to regular heatsinks of the same size. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pad, it transfers 2.7x more heat than regular thermal pads in the same time period. 6mm Heatpipe helps to transfer heat between heatsinks which to get thermal balance more quickly. On the back, we use Nanocarbon coating on baseplate, which leads to 10% cooler MOSFETs.

1. Fins-Array Heatsink
Increase 300% heat dissipation area compared to traditional heatsink in same size.

2. High Thermal Conductivity Pad
By using 1.5mm thicker 5 W/mK thermal conductivity pad, it transfer 2.7x more heat than usual thermal pad in the same time period.

3. Aluminum Baseplate
Provides stronger support to the platform as well as better radiant heat dissipation.

4. 3 x 6mm Heatpipe
Heatpipe helps to transfer heat between heatsinks that helps to get thermal balance of the MOSFETs more quickly.

Smart Fan 5

With Smart Fan 5 users can ensure that their PC can maintain its performance while staying cool. Smart Fan 5 allows users to interchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 more hybrid fan headers that support both PWM and Voltage mode fans have been introduced to make the motherboard more liquid cooling friendly.

Fan Pin Headers

Fan / Water Pump Pin Headers

Internal Temperature Sensors

External Temperature Sensors

Noise Detection Cable

Different models have different number of fan pin headers and temperature sensors. Smart Fan 5 function may vary by model.

Temperature Sensors

Hybrid Fan Headers

Temperature Sensor Cable x 2

Noise Detect Cable x 1

■ 8 Fan / Water Pump Connectors
■ 7 Temperature Sensors
■ 2 External Temperature Sensors
■ 1 Noise Detection Cable
■ All Hybrid Fan Headers
■ Interoperable Fans and Sensors
■ Supports High Current Fans up to 24W(2AX12V) with Over-Current Protection
■ Intuitive UI for Fan Control

ALC1220-VB Immersive Gaming ViBes

All New Realtek High-End HD Audio Codec

ALC1220 120dB(A) SNR HD Audio with Smart Headphone Amp automatically detects impedance of your head-worn audio device, preventing issues such as low volume and distortion.
With the new VB series audio controller, stream your voice to the world vibrantly with both front/rear microphone SNR up to 110/114dB(A).

DTS :X^® Ultra

Recreates an authentic, spatially accurate 3D audio experience for gaming over any headphones or speakers. Supports channel-based, scene based and object-based audio. Provides out-of-the-box calibration for a range of headphones and speakers. Provides post-processing enhancements and device level tuning for DTS^® codecs.

DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.

Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound-app

*DTS Sound Unbound needs the latest Windows fixes in the Windows 10, please upgrade your Windows 10 OS to Win10 Build 18898 or later versions.

DTS:X Ultra Technology Video

DTS:X Ultra Experience Video

Integrated I/O Shield Armor
Durable Design And Easy Installation

With an integrated I/O shield, building a GIGABYTE Ultra Durable PC is even easier and convenient. Users can expect excellent durability with the durable design of the pre-installed I/O shield.