Unique Design
Ultra Durable™ 3
Leading the Motherboard Industry Inside and Out!
GIGABYTE Ultra Durable™ 3 + Smart 6™ Technology
Copper Cooled Quality
Ultra Durable™ 3
  GIGABYTE Ultra Durable™ 3 Technology
GIGABYTE Ultra Durable™ 3 series motherboards once again lead the motherboard industry for the highest quality and most innovative motherboard design. Featuring the industry's first consumer desktop motherboard design to introduce 2 ounces of copper for both the Power and Ground layers, GIGABYTE Ultra Durable™ 3 motherboards deliver dramatically lower system temperature, improved energy efficiency and enhanced stability for overclocking.
Ferrite Core
50,000 hrs. Japanese Solid Capacitor
Lower RDS(on)
2 oz Copper
Inner Layer
Signal Layer
Power /
Ground layer
Ground layer
Signal Layer
PCB (Printed Circuit Board)
2 oz copper PCB = weight of copper layer
30.48 cm x 30.48 cm (1 square foot) PCB is 56.7 g (2 oz)
Copper Layer  Thickness
2X copper 0.070mm (70 µm)
1X copper 0.035mm(35 µm)
  CPU VRM Temperature measurements under system setup with water-cooler block and CPU running at 100% loading
      The benefits of 2 oz Copper PCB design
Better Power
2X Lower
Lower EMI Better ESD
Lower Temperature
Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. In fact, GIGABYTE Ultra Durable™ 3 motherboards are able to deliver twice as cool working temperatures than traditional motherboards.
Infra Red CPU VRM Thermal Diagram
 * CPU VRM Temperature measurements under CPU running at 100% loading.
2X Lower Impedance
In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable™ 3 motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality, providing better system stability and allowing greater margins for overclocking.
2 oz Copper PCB
1 oz Copper PCB

Impedance Ω
  Lower is better
Better Overclocking
Delivering native support for DDR3 2200+ and DDR2 memory up to 1366+ MHz, GIGABYTE Ultra Durable™ 3 series motherboards allow users to reach higher memory frequency at lower voltage; achieving higher memory performance with lower power consumption to run even the most memory intensive applications such as high-definition video and 3D games with ease.
Lower EMI
A good PCB circuit layout is the key of controlling EMI emission. GIGABYTE's Ultra Durable™ 3 design features 2 ounces of copper for ground layers, improves signal integrity and lowers EMI emissions through a very effective ground plane.

* Electromagnetic interference (or EMI) is an unwanted disturbance signals that affects surrounding electronic devices.
Better Power Efficiency
Increasing the thickness of the motherboard PCB Power layer by using 2 ounces of Copper allows the electric current to flow with less resistance, enabling more power efficient circuits with lower power loss and less heat generated.
Better ESD Protection
2 ounces of Copper for the Ground layer of the motherboard PCB allows for a more efficient Electro-Static Discharge (ESD) of up to 10%. This helps to better protect the motherboard components against damage caused by static electricity.
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Ultra Durable™ 3 Smart 6