MD61-SC2
(rev. 1.x)

Discontinued

Intel^® C621 Chipset

2nd Gen. Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
6-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
2 x 10Gb/s SFP+ and 2 x 1Gb/s LAN ports
1 x Dedicated management port
3 x SlimSAS (for 12 x SATA 6Gb/s) ports
2 x SATA DOM supported
2 x U.2 with PCIe Gen3 x4 interface
Up to 4 PCIe Gen3 expansion slots
1 x mezzanine type slot with PCIe Gen3 x16 interface
Aspeed^® AST2500 remote management controller

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behalt sich das Recht vor, ohne Vorwarnung Inhalte zu verandern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers fur die Nutzung des Systems reserviert und daher kann die aktuelle Speichergrose von der Speicherangabe abweichen.

SPECIFICATIONS

Form Factor

E-ATX
305W x 330D (mm)

CPU

2nd Generation Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

2 x LGA 3647
Socket P
Recommended Fan module: Dynatron B5
CPU TDP up to 205W

Chipset

Intel^® C621 Chipset

Memory

16 x DIMM slots
DDR4 memory supported only
6-channel memory per processor architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 205W (Max.)
* DCPMM 256GB x4 pcs

DCPMM installation locations:
DIMM_P0_(A1, D1)
DIMM_P1_(G1, J1)

NOTE:
1. 2933MHz for 2nd Generation Intel^® Xeon^® Scalable Processors only
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative

LAN

2 x 10Gb/s SFP+ LAN ports (QLogic^® QL41102)
2 x 1Gb/s LAN ports
1 x 10/100/1000 management LAN

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Audio

N/A

SAS

N/A

SATA

3 x SlimSAS for 12 x SATA III 6Gb/s ports
2 x 7-pin SATA III 6Gb/s with SATA DOM supported

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

Slot_7 (PCIe_4): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_6 (PCIe_3): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_5 (PCIe_2): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_4 (PCIe_1): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_0

1 x Mezzanine card slot:
- PCIe Gen3 x16 (x8+x8)
- From CPU_0
- Optional for OCP mezzanine card with low profile type

2 x U.2 ports:
- SlimSAS type
- PCIe Gen3 x4 per port
- From CPU_0
- Shared with Mezzanine card x8 signal
- For GIGABYTE server system backplane board use only

Internal I/O

1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
2 x SATA DOM power pin headers
5 x SlimSAS connectors
2 x 7-pin SATA connectors
2 x CPU fan headers
5 x System fan headers
1 x USB 3.0 header
1 x COM_1 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x HDD back plane board header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Case open header
1 x Buzzer

Rear I/O

2 x USB 3.0
1 x VGA
2 x SFP+
2 x RJ45
1 x MLAN
1 x ID button with LED
2 x LAN activity LEDs

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

OS Supported

For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Board Management

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

PSU Connectors

1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Retail Packaging Content

1 x MD61-SC2
1 x I/O shield
1 x Quick start guide
2 x SlimSAS for 8 x SATAIII 6Gb/s 600mm cables
2 x Non-Fabric CPU carrier
Single Box dimensions: 409 x 355 x 78 mm
Carton dimension: 729 x 415 x 432 mm
Quantity: 10 x single box with one carton

Bulk Packaging Content

10 x MD61-SC2
10 x I/O shields
20 x Non-Fabric CPU carrier
Carton dimensions: 473 x 600 x 495 mm

Reference Numbers

Retail: 9MD61SC2MR-00
Bulk: 9MD61SC2NR-00

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behält sich das Recht vor, ohne Vorwarnung Inhalte zu verändern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers für die Nutzung des Systems reserviert und daher kann die aktuelle Speichergröße von der Speicherangabe abweichen.

SUPPORT

Downloads

Treiber
BIOS
Utility
Firmware

Handbuch
Kompatibilitätsliste

Online Support

Treiber

BIOS

Utility

Firmware

QVL

All
All
Windows Server 2019
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Ubuntu 16.04.2 LTS x64
Ubuntu 14.04.5 LTS x64
SLES 12.2 x64
SLES 11.4 x64
RHEL 7.3 x64
RHEL 6.9 x64
Linux

Chipset

Version

Größe

Datum

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

Apr 18, 2019

MD61-SC2 (rev. 1.x)

SPECIFICATIONS

SUPPORT

RESOURCES

MD61-SC2 (rev. 1.x)

MD61-SC2
(rev. 1.x)