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| ‧Proprietary front-flow thermal module |
| A first Dual-slot heatpipe solution, including
the convection slot at the backside of chassis to increase
thermal efficiency. |
| ‧High-precision die-casting forming design |
| Uses the latest high-precision forming technology,
increasing the largest cooling superficial measure of heatsink. |
| ‧Built for dual-card configuration |
| Ensure top-notch compatibility and performance
for all dual card configurations. |
| ‧High performance heatpipe with sintered powder
wicks |
| With the industry’s best powder-style heatpipe
with pure copper, providing the powerful efficiency of thermal
distribution. |
| ‧3D performance ready |
| The special design to keep the high stability
of PC system. |
| ‧Integrated architecture design |
| Delivering the best heat conduction by touching
rigidly heatpipe and GPU, and use copper-touched distribution
to spread heat. |
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| ‧Under the thermal cam system monitoring,
purple color means lower temperature, and white
color means higher temperature. |
| ‧Silent-Pipe II Technology delivers
powerful thermal performance, and transfers heat
efficiently from GPU side to back side. |
| ‧Especially, GIGABYTE’s proprietary
front-flow thermal module excellently contribute
to the whole system convection to stay cool. |
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