Front-flow thermal module with layered long-short fins
High-performance heat pipe with sintered powder wicks and 90% of the heat sink is covered by heat pipe
Advanced Screen-Cooling™ thermal design
Copper thermal conductive base
Inner Turbulence Fluid Mechanics Design Utilizing a series of layered long and short fins with trapezoid punches, Silent-Pipe 3™ transforms laminar (smooth) air flow into turbulent (rough) air flow inside the heat sink, increasing the heat exchange ratio and enhancing overall thermal performance.
Front-flow thermal module with layered long-short fins Silent-Pipe 3™ features a series of layered fins both short and long which can increase the flow rate, pulling colder air into chassis fast.
90% of the heat sinkis covered by heat pipe
Advanced Screen-Cooling™ thermal design Silent-Pipe 3™ also uses the extended heat sink, Screen-Cooling™ like thermal design, which utilizes the natural air flow in the case to cool down.
Copper thermal conductive base Silent-Pipe 3™ features all-copper thermal conductive base to be a medium from front-flow thermal module to GPU touch pad. In addition, with high-performance copper heat pipe, Silent-Pipe 3 guarantees best cooling effects.
