• AMD EPYC™ 9004 Series processors
  • AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
  • Dual processor, 5nm technology
  • 12-Channel RDIMM DDR5, 24 x DIMMs
  • Dual ROM Architecture
  • 2 x 1Gb/s LAN ports via Intel® I350-AM2
  • 1 x Dedicated management port
  • 12 x 2.5" SATA/SAS hot-swappable bays
  • 3 x M.2 slots with PCIe Gen3 x4 and x2 interface
  • 2 x FHHL PCIe Gen5 x16 slots
  • 2 x OCP 3.0 Gen5 x16 slots
  • Dual 1600W 80 PLUS Platinum redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
1U
438 x 43.5 x 815
Motherboard
MZ93-FS0
CPU
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C

Supports EPYC 9654 cTDP 400W, OCP3.0 ≦ 21W at ambient 30°C.

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MT/s
LAN
Rear side:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
12 x 2.5" SATA/SAS hot-swappable bays, from CPU_0

SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
N/A
Expansion Slots
Riser Card CRS101T:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_0

Riser Card CRS101Q:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_1

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_1
Supports NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x2, from CPU_1
- Supports 2280/22110 cards
Internal I/O
1 x TPM header
Front I/O
1 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 200-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
VMware ESXi 8.0 or later
Windows Server 2022
System Fans
8 x 40x40x56mm (32,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 22.77 kg
Gross Weight: 26.71 kg
Packaging Dimensions
1045 x 595 x 249 mm
Packaging Content
1 x R183-Z92-AAD3
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR183Z92DR000AAD3*
- Motherboard: 9MZ93FS0UR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0206-K0R
- CPU heatsink: 25ST1-553202-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1013: 9CFP1030NR-00
- Backplane board - CBP10C0: 9CBP10C0NR-00
- Fan module: 25ST2-40562H-A0R
- Riser card - CRS101Q: 9CRS101QNR-00
- Riser card - CRS101T: 9CRS101TNR-00
- G-SCM board - CDCR114: 9CDCR114NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-216008-L0S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- RMA packaging: 6NR183Z92SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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  • Windows Server 2022
  • Windows Server 2019
  • Linux
網路介面
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

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  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
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GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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