H231-H60
(rev. 100/A00)

HPC/AI Server - 1st/2nd Gen Intel® Xeon® Scalable - 2U 2-Node DP 2 x PCIe Gen3 GPUs
  • Supports up to 2 x Dual slot Gen3 GPUs
  • NVIDIA® validated GPU platform; Supports for NVIDIA® Tesla® GPUs
  • 2U 2-node rear access server system
  • 1st/2nd Gen Intel® Xeon® Scalable Processors
  • Dual processor per node, LGA 3647
  • Intel® C621 Chipset
  • 6-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
  • Supports Intel® Optane™ DC Persistent Memory
  • 2 x Dedicated management ports
  • 1 x CMC port
  • 4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
  • 20 x 2.5" SATA/SAS hot-swappable bays
  • 2 x LP PCIe Gen3 x16 slots
  • 2 x LP PCIe Gen3 x8 slots
  • 2 x OCP Gen3 x16 mezzanine slots
  • Aspeed® AST2500 remote management controller
  • Dual 2200W 80 PLUS Platinum redundant power supply
  • Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
Get a Quote
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87 x 820
Motherboard
MH61-HD5
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Note: This device does not support Intel Omni-Path function.
Socket
Per Node:
2 x LGA 3647

Total:
4 x LGA 3647

Socket P
Chipset
Intel® C621 Chipset
Memory
Per node:
16 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MT/s memory is supported only with 2nd Generation Intel® Xeon® Scalable Processors.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Per node:
1 x Dedicated management port

Total:
2 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port

Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip in CMC board:
Integrated in Aspeed® AST1250
Storage
Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
10 x 2.5" SATA/SAS hot-swappable bays

1 x Broadcom SAS35x24R expander

Default configuration supports:

2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays

2 x Broadcom SAS35x24R expander

Default configuration supports:

4 x U.2 and 0 x SAS/SATA drives

SAS card is required to enable the drive bays
RAID
For SATA drives:
Intel® SATA RAID 0/1/5/10

For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1

Note: VROC module is for Intel®SSD only.
Expansion Slots
Per node:
1 x PCIe x16 (Gen3 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Total:
2 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs
2 x PCIe x16 (Gen3 x16) low-profile slots
2 x PCIe x8 (Gen3 x8) low-profile slots

2 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth

Note: For the latest GPU QVL, please contact your GIGABYTE representative.
Internal I/O
Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED

Total:
4 x USB 3.0
2 x VGA
2 x MLAN
2 x ID LEDs
*1 x CMC port

*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
System Management
Aspeed® AST2500 management controller
Avocent® MergePoint IPMI 2.0 web interface:
  • Network settings
  • Network security settings
  • Hardware information
  • Users control
  • Services settings
  • IPMI settings
  • Sessions control
  • LDAP settings
  • Power control
  • Fan profiles
  • Voltages, fans and temperatures monitoring
  • System event log
  • Events management (platform events, trap settings, email settings)
  • Serial Over LAN
  • vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note: Please contact Technical Support for more information about optimized GPU system operating temperature.
Weight
30 kg (full packaging)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H231-H60
4 x CPU heatsinks
1 x Rail Kit
1 x VROC module
4 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH231H60MR-00*
- Motherboard: 9MH61HD5NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.

SUPPORT

  • All
  • All
  • Windows Server 2019
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Linux
SATA RAID/AHCI
SATA RAID/AHCI
버전
사이즈
날짜
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
경고:
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.

What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
유틸리티
설명
버전
사이즈
날짜
GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
매뉴얼
설명
버전
사이즈
날짜

RESOURCES

Security & Technical Advisory
Back to H231-H60
{{ selectedProductCount }}
Compare
  • {{ selectedProducts[index].modelName }}
Clear All
돌아가기
You may only add up to 4 items for comparison at one time.