H261-PC0

‏(rev. 100)‏

2U 4-Node - Rear access
440 x 87 x 840

MH61-HD6

2nd Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® Scalable Processors
Dual processor per node, TDP up to 205W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Note: This device does not support Intel Omni-Path function.

Per Node:
2 x LGA 3647

Total:
8 x LGA 3647

Socket P

Intel^® C621 Chipset

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel^® Xeon^® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MT/s for 2nd Generation Intel^® Xeon^® Scalable Processors only.
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.

Per node:
1 x Dedicated management port

Total:
4 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port

Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Per node:
6 x 2.5" SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
24 x 2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

Intel^® SATA RAID 0/1/5/10

Per node:
Riser Card CRSH010:
- 1 x PCIe x16 (Gen3 x16) low-profile slot

Riser Card CRSH011:
- 1 x PCIe x8 (Gen3 x8) low-profile slot

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Total:
Riser Card CRSH010 x 4:
- 4 x PCIe x16 (Gen3 x16) low-profile slots

Riser Card CRSH011 x 4:
- 4 x PCIe x8 (Gen3 x8) low-profile slots

4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth

Per node:
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system.

Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note: The system power supply requires C19 power cord.

Aspeed^® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update 3 or later
VMware ESXi 6.5 Update 2 or later
VMware ESXi 6.7 Update 1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Net Weight: 27.3 kg
Gross Weight: 45.92 kg

1180 x 779 x 300 mm

1 x H261-PC0
8 x CPU heatsinks
1 x Rail kit
8 x Non-Fabric CPU carriers

- Barebone package: 6NH261PC0MR-00-1*
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH262Z65SR-00-100