H262-Z61

‏(rev. 100)‏

2U 4-Node - Rear access
440 x 87.5 x 840

MZ62-HD0

AMD EPYC™ 7002 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 200W

NOTE:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU

Compatible with AMD EPYC™ 7001 Series processors

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

System on Chip

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200 MHz

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Per node:
6 x 2.5" SATA/SAS hot-swappable bays, from CPU_0

Total:
24 x 2.5" SATA/SAS hot-swappable bays, from CPU_0

SAS card is required for SAS devices support

Depends on SAS add-on card

N/A

Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED

*Only one CMC status LED per system

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port

*Only one CMC port per system

Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Dual 2200W 80 PLUS Platinum redundant powers supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: System power supply requires C19 power cord

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP4 (x64) or later
SUSE Linux Enterprise Server 15 SP1 (x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.1.0 or later

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Net Weight: 47.63 kg
Gross Weight: 49.63 kg

1180 x 779 x 300 mm

1 x H262-Z61
8 x CPU heatsinks
1 x 3-Section Rail kit

- Barebone package: 6NH262Z61MR-00-1*
- Motherboard: 9MZ62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z61SR-RMA-A100