QBiX-JMB-CFLA310HG-A1
Intel® H310 Express Chipset
Industrial system with Intel® H310 Chipset, support of Intel® 9th/8th Gen Processors and Discrete GFX support
System Size : 224W x 343D x 146H(mm) - Discrete GFX support (optional)
Support Intel® 9th/8th Gen Processor
Dual Channel DDR4, 2 x SO-DIMMs
DVI-D, VGA & DP ports for multiple display
4 x GbE LAN Ports
4 x COM Ports
8 x USB Ports
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8th/9th Generation Intel® Core™ ProcessorsIntel's blazing fast, feature packed processor family with built-in security is ready to take your productivity, and creativity to the next level. And, by enabling new exciting Windows 10 features, the 8th/9th generation Intel Core processors empower you to unleash your imagination and explore the possibilities.
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DisplayPort SupportFeaturing DisplayPort, a next generation graphics display interface that delivers up to 10.8 Gbps of bandwidth over standard cables, providing billions of colors with the fastest refresh rates and the greatest color depths.
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M.2 Onboard ConnectorProviding users PCI-Express connectivity for SSD devices. Delivering up to 10 Gbps data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA and even SATA Revision 3 6Gbps storage devices.
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2.5" SATA Hard Drive SupportUtilizing SATA III 6Gb/s high speed data transfer technology, the xxx supports the installation of one 2.5” SATA hard drive and one mSATA SSD module. This allows for optimized storage configurations which combine fast SSD performance with larger capacity hard drives.
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Operating Properties
Operating temperature: -20°C to 60°C (CPU TDP 35W, Add external GFX card Kits)
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Processor Supported
Support for 9th/8th Generation
Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors in the LGA1151 package
TDP under 65W
Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors in the LGA1151 package
TDP under 65W
Chipset Description
Intel® H310 Express Chipset
Memory Type
2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB
Support Dual channel DDR4 2666/2400 MHz memory modules
Support Dual channel DDR4 2666/2400 MHz memory modules
Integrated Network
1 x GbE LAN Port (Intel® I219V)
3 x GbE LAN Ports (Intel® I211AT)
3 x GbE LAN Ports (Intel® I211AT)
Integrated Video Controller
Integrated Graphics Processor - Intel® HD Graphics support:
1 x DP port, supporting a maximum resolution of 4096x2160 @30Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz
(2 independent display outputs)
1 x DP port, supporting a maximum resolution of 4096x2160 @30Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz
(2 independent display outputs)
Integrated Audio Controller
Realtek® Audio Codec
Expansion Slot
1 x 2280 M.2 M-Key (SATA 6Gb/s)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module
1 x PCIe slot -- Discrete riser card support
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module
1 x PCIe slot -- Discrete riser card support
Rear I/O Connectors
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Packaging Bundle
Carton size: 460 x 315 x 279 (mm)
Packing Capacity: 1pc
Including:
Power Cable #20 350mm x 1 (P/N: 25CRI-350902-H3R)
Screw M3x4L x 12 (P/N: 25984G-1C014-S00)
Screw M3x5L x 8 (P/N: 25983G-1C011-S00)
Screw #6-32x5L x 3 (P/N: 2598EG-1C002-S00)
Terminal Blocks Male Plug x 1 (P/N: 25IO0-2ESDV0-D2R )
Packing Capacity: 1pc
Including:
Power Cable #20 350mm x 1 (P/N: 25CRI-350902-H3R)
Screw M3x4L x 12 (P/N: 25984G-1C014-S00)
Screw M3x5L x 8 (P/N: 25983G-1C011-S00)
Screw #6-32x5L x 3 (P/N: 2598EG-1C002-S00)
Terminal Blocks Male Plug x 1 (P/N: 25IO0-2ESDV0-D2R )
Ordering Information
System : 9BQJH310AMR-SI & 6BQJH310APR-SI
(Built in Components: Please contact with your sales representative for more information or e-mailed to : sales@gigaipc.com)
(Built in Components: Please contact with your sales representative for more information or e-mailed to : sales@gigaipc.com)
Storage
3 x 2.5" HDD/SSD (SATA 6Gb/s)
Front I/O
1 x Power Switch/Power/HDD LED
3 x Audio Jacks (Line in, Line out, Mic in)
1 x Display port
1 x DVI-D
1 x VGA
2 x COM Ports (RS-232/422/485 & RI/5V/12V)
2 x COM Ports (RS-232)
4 x RJ45 LAN Ports
4 x USB 3.2 Gen 1
4 x USB 2.0
1 x 4-pin Terminal Block
2 x External Antenna Holes (Optional)
3 x Audio Jacks (Line in, Line out, Mic in)
1 x Display port
1 x DVI-D
1 x VGA
2 x COM Ports (RS-232/422/485 & RI/5V/12V)
2 x COM Ports (RS-232)
4 x RJ45 LAN Ports
4 x USB 3.2 Gen 1
4 x USB 2.0
1 x 4-pin Terminal Block
2 x External Antenna Holes (Optional)
Dimension
224W x 343D x 146H(mm) - Discrete GFX max 250W support (Optional)
Remark
TPM 2.0 module P/N: 9CTM000NR-00
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
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