H230-R4C
(rev. 100)

已停產

2U 4 Nodes High Density Rack Server

2U - 4 nodes with rear access to the node trays
Intel^® Xeon^® processor E5-2600 V3 / V4 product family
8 x LGA 2011-3 sockets
Intel^® C612 chipset
32 x DDR4 slots
8 x GbE LAN ports (Intel^® I350)
12 x 3.5” hot-swappable HDD/SSD bays
1600W 80 PLUS Platinum redundant PSU

* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
448 x 87 x 820

Motherboard

MH50-HD1

CPU

Intel^® Xeon^® E5-2600 V3 processors
Intel^® Xeon^® E5-2600 V4 processors
NOTE: If only 1 CPU is installed, some PCIe, memory, I/O functions might be unavailable.

Socket

Per node:
2 x LGA 2011-3
Total:
8 x LGA 2011-3
Mounting pitch: square ILM (80x80mm)
Max. length of M4 screw threads: 3.7mm
Screws longer than 3.7mm might damage the motherboard

Chipset

Intel^® C612

Memory

Per node:
8 x DIMM slots

Total:
32 x DIMM slots
DDR4 memory supported only
Quad channel memory architecture
RDIMM modules up to 32GB supported
LRDIMM modules up to 64GB supported
3DS LRDIMM modules up to 128GB supported
1.2V modules: 1600/1866/2133/2400 MHz

LAN

Per node:
2 x GbE LAN ports (Intel^® I350-AM2)
1 x 10/100/1000 management LAN

Total:
8 x GbE LAN ports (Intel^® I350-AM2)
4 x 10/100/1000 management LAN
1 x 10/100/1000 *CMC LAN

*CMC: Chassis Management Controller, to monitor all status of computing nodes.

Video

Integrated in Aspeed^® AST2400
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip in CMC board:
Integrated in Aspeed^® AST1050
Support IPMI only, if iKVM is required, please use dedicated management LAN port (from AST2400) of each node

Audio

Storage

Per node:
3 x 3.5" hot-swappable HDD/SSD bays

Total:
12 x 3.5" hot-swappable HDD/SSD bays

RAID

Intel^® SATA RAID 0/1/5/10

Peripheral Drives

Expansion Slots

Per node:
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector
1 x Mezzanine PCIe x8 (Gen3 x8 bus) connector
1 x M.2 slot ( Gen3 x4) - NGFF-2242/2260/2280, M-Key

Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors
4 x Mezzanine PCIe x8 (Gen3 x8 bus) connectors
4 x M.2 slot ( Gen3 x4) - NGFF-2242/2260/2280, M-Key

Internal I/O

Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x PMBUS header
1 x PMBUS selection jumper
1 x BMC FRB jumper
1 x Clear CMOS jumper
1 x Power on selection jumper
1 x ACK selection jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED

*Only one CMC status LED per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID button with LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN 4 x ID button with LED
*1 x CMC MLAN

*Only one CMC MLAN per system

Backplane Board

12 x SAS/SATA ports
12Gb/s & 6Gb/s compatible

TPM

1 x TPM header

Power Supply

2 x 1600W redundant PSU
80 PLUS Platinum

AC Input:
100-127V~/ 12.9A, 50-60Hz
200-240V~/9.5A, 50-60Hz
DC Output:
Max 1000W@100-127V
+12V/ 83A
+12Vsb/ 2.1A
Max 1600W@200-240V
+12V/ 133A
+12Vsb/ 2.1A

System Management

Aspeed^® AST2400 management controller
Avocent^® MergePoint IPMI 2.0 web interface:

Cold Redundancy
Intelligent Power Management (IPM)
Network settings
Network security settings
Users control
Services settings
IPMI settings
Sessions control
LDAP settings
Power control
Voltages, fans and temperatures monitoring
System event log
Events management (platform events, trap settings, email settings)
Serial Over LAN
vKVM & vMedia (launch, configuration)

OS Compatibility

Windows Server 2008 R2 (x64)
Windows Server 2012 (x64)
Windows Server 2012 R2 (x64)
Windows Server 2016

Red Hat Enterprise Linux 6.7 (x86/x64)
Red Hat Enterprise Linux 7.2 (x64)

SUSE Linux Enterprise Server 11.4 (x86/x64)
SUSE Linux Enterprise Server 12 (x64)

Ubuntu 12.04 LTS (x86/x64)
Ubuntu 14.04 LTS (x86/x64)

VMware ESXi 5.1 U2
VMware ESXi 5.5 U2
VMware ESXi 6.0 U1

System Fans

4 x 80x80x38mm (16’300rpm)

Operating Properties

Operating temperature: 5°C to 35°C
Non-operating temperature: 0°C to 40°C
10-80% operating humidity at 30°C

Weight

35 kg (full packaging)

Packaging Dimensions

1167 X 700 X 309 mm

Packaging Content

1 x H230-R4G
8 x CPU heatsinks
1 x Quick start guide
1 x Rail Kit

Part Numbers

- Barebone: 6NH230R4CMR-00
- Power Supply: 25EP0-216005-C1S
- Tool-less rail kit: 25HB2-NJ2102-N1R
- CMC daisy chain kit: 6NH23NR48SR-00-100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Windows Server 2012 64bit
Windows Server 2008 R2 64bit
Ubuntu 14.04 LTS x86
Ubuntu 14.04 LTS x64
Ubuntu 12.04 LTS x86
Ubuntu 12.04 LTS x64
SLES 12 x64
SLES 11.4 x86
SLES 11.4 x64
RHEL 7.2 x64
RHEL 6.7 x86
RHEL 6.7 x64

晶片組

版本

檔案大小

日期

Intel® INF Driver

Version : 10.1.2.10

2.76 MB

Mar 31, 2016

H230-R4C (rev. 100)

SPECIFICATIONS

SUPPORT

RESOURCES

H230-R4C (rev. 100)

H230-R4C
(rev. 100)