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Insist on an Ultra Durable™ Motherboard for your new PC
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The Industry's Highest Quality CPU Power Design
Our Best Ultra Durable™ Motherboards Yet
GIGABYTE is yet again raising the bar of motherboard quality and durability with their latest Ultra Durable™ 5 technology, featuring a range of High Current Capable components that provide the highest quality power delivery to the CPU for record-breaking performance, cool and efficient operation and extended motherboard lifespan.

GIGABYTE breaks Core i7 3770K OC World Record at 7102MHz with upcoming Z77X-UP7
IR3550 PowIRstage®
Highest rated and most awarded Power Stage in the industry.
• Providing power delivery rated up to 60A, while maintaining cool operating temperatures.
• Perfect Match: GIGABYTE Ultra Durable™ 5 motherboards use both IR digital PWM
  controllers and IR PowIRstage® ICs, for a uniquely seamless power delivery system.
• Industry Leading Peak Efficiency up to 95%
Optimal CPU Power Design
2X Copper PCB
Providing sufficient power trace paths between components to handle exceptional power loads associated with overclocking and to remove heat from the critical CPU power delivery area.

High Capacity Ferrite Core Chokes
Rated up to 60A to provide the most stable power delivery.

* Actual component specifications may vary by model.



Cool Power, Inside and Out
GIGABYTE Ultra Durable™ 5 motherboards use IR3550 PowIRstage® ICs, which feature the industry's highest 60A rating, with Lower Losses, Higher Efficiency and Excellent Thermal Management.
The layout and packaging use copper connections for all power paths rather than wire bonds, reducing losses due to high resistance wire bonds as well as high inductance which causes ringing and high AC losses.

Power connections between the MOSFETs use very low loss copper, reducing losses and helping to spread the heat.
Specialized MOSFET driver IC by International Rectifier.
High side MOSFET (Control FET) has very low gate charge. Low side MOSFET (SyncFET) has an integrated Schottky Diode for even higher efficiency.
The current has very short paths from the bottom of the device, through either the control FET (duty cycle ON) or the Sync FET (Duty cycle OFF) and through the copper clip. This is another reason the device is so durable and can handle 60A.
Custom Copper leadframe conducts heat away from the silicon.
Traditional CPU Power Zone Design

PWM controller
MOSFET Drivers
Traditional High and
Low side MOSFETs
CPU Power Zone Q & A
What is the CPU Power Zone ?
The CPU Power Zone contains the various components of a motherboard that are responsible for delivering power to the CPU (PWM controller, MOSFET Drivers, High and Low side MOSFETs , Chokes, Capacitors and related circuitry).

What is a MOSFET ?
A MOSFET is one of the most critical components of the CPU power zone, as it is a switch that first allows or disallows electric current to flow to the CPU. Its switching is controlled by the MOSFET driver and PWM controller. It is also one of the most expensive components of the power design.

What is a Power Stage ?
A Power Stage is a single chip that includes the MOSFET driver, 1 high side MOSFET and 2 (or sometimes 1) Low Side MOSFETs . Power Stages are made using a more advanced manufacturing process, and are therefore more efficient.

What is a Traditional MOSFET (Also known as D-Pak MOSFET...) ?
A Traditional MOSFET is a less advanced MOSFET design that is used in a traditional CPU power zone where the MOSFET drivers and High and Low Side MOSFETS are each individual chips (multi-chip MOSFET design). They are less expensive and less efficient than single chip Power Stages.
Single Package Design
IR has leveraged it's world class packaging technology developed for the DirectFET®, improving the thermal capability and layout of the PowIRstage® significantly over that of other MCM packages.
Single Package Design*
Multi-Chip Design         
High Side MOSFET
Driver IC
* patent pending
Other MOSFET layout implementations use a multi-chip, side-by-side arrangement of the high and low side MOSFETs and driver IC, taking up significant board real estate and creating more electrical leakage.
High Side MOSFET
(Traditional MOSFET)
(Traditional MOSFET)
Driver IC
(MOSFET Driver)
Power Stage
(Also known as IR3550 PowIRstage® )
Lower RDS(on) MOSFET (Ultra Durabnle™ 4 Design)
(Also known as WPAK, PowerPAK MOSFET...)
8 pins
(4 right, 4 left)
Traditional MOSFET (Also known as D-Pak MOSFET...)
3 pins
(1 right, 2 left)
Size ratio between objects is constant
Driver IC Developed by International Rectifier
IR3550 PowIRstage® ICs feature a specialized MOSFET driver IC which is tuned perfectly for the MOSFET pair. Many Driver MOSFET companies use drivers from other companies, thus the drivers are not really optimized for the MOSFETs. With co-packaged Driver+MOSFETs, IR has designed this driver to optimize this module for greatest efficiency.
IR3550 Power Stage X-ray picture    
IR3550 Power Stage decapsulation picture   
Ultra Cool, Ultra Efficient, Ultra Performance
High Efficiency = Low Power Loss = Less heat = Longer Lifespan
IR's IR3550 PowIRstage® are more power efficient and operate cooler than competing MOSFETs, resulting in longer component lifespan and more head room for greater overclocking performance.
Traditional MOSFET
IR3550 PowIRstage®
* Testing result for reference only. Results may differ according to system configuration.
* 4 phase IR3550 PowIRstage® with 2x Copper PCB vs. 4 phase traditional MOSFET @ 100A load 10 mins lab testing without heatsink.
IR3550 PowIRstage® ICs feature greater power efficiency and are the industry's highest rated MOSFETs, able to provide up to 60A of power. This ensures the best power delivery to the CPU, for more stable operation and better overclocking performance.
16 Traditional MOSFETs in Operation
4 PowIRstage® ICs in Operation
up to
IR3550 PowIRstage® ICs are so efficient, that even though the 4 PowIRstage® ICs in operation on the right are doing the same workload as the 16 traditional MOSFETs in operation on the left, their temperature is still up to 30° C cooler than the traditional MOSFET design.
* Testing result for reference only. Results may differ according to system configuration.
Configuration: Intel Core™ i7-3770K CPU, Default CPU frequency (3.5GHz), 1.2V Vcore, Default BIOS setting, DDR3 1333MHz, 500W PSU, CPU water cooling with no MOSFET heatsink. Software: Microsoft Windows® 7 running Power Thermal Utility at 100% loading.
IR3550 PowIRstage® ICs remain cooler than other MOSFET designs, allowing users to overclock to greater levels of performance. Each power component has a maximum thermal operational temperature, and once it is reached, adding more voltage will only result in a failed overclock. Since IR3550 PowIRstages® are able to operate at cooler temperatures at higher voltages than traditional designs, overclockers are able to have more headroom to increase voltages, resulting in higher potential overclocks.
Cooler temps. = Higher Overclocks
MOSFET Overclocking Stability
Not enough power
for overclocking
Lower RDS(on)

(Also known as WPAK, PowerPak MOSFET...)
Traditional MOSFET
(Also known as D-Pak MOSFET... )
Industry Leading Peak Efficiency up to 95%*

IR3550 PowIRstage® ICs are more efficient, with peak efficiency up to 95%, during normal operation.

Even at higher Current levels, IR3550 PowIRstage® ICs are able to maintain lower power losses. Lower power loss also means less heat as a byproduct.

* Testing result for reference only. Results may differ according to system configuration.
VIN=12V, VOUT=1.2V, ƒSW = 300kHz, L=210nH (0.2mΩ), VCC=6.8V, CIN=47uF x 4, COUT =470uF x3, 400LFM airflow, no heat sink, 25°C ambient temperature, and 8-layer PCB of 3.7" (L) x 2.6" (W).
Current Typical MOSFET Designs
Power Stage
(Also known as IR3550 PowIRstage®)
Premium Cost
Highest Efficiency
Lowest Temperature
Lower RDS(on) MOSFET
(Also known as WPAK, PowerPAK,
High Cost
Good Efficiency
Low Temperature
Traditional MOSFET
(Also known as D-Pak MOSFET...)
Low Cost
Low Efficiency
High Temperature



Quality Inside and Out
Even though several of the high quality components used in GIGABYTE Ultra Durable™ motherboards are not visible from the outside, rest assured that they are working hard to provide better efficiency, greater power savings, lower system temperatures, better overclocking performance and extended system longevity. That’s the GIGABYTE Ultra Durable™ guarantee.
PCB (Printed Circuit Board)
2x copper PCB = 2 oz copper PCB = weight of copper layer
30.48 cm x 30.48 cm (1 square foot) PCB is 56.7 g (2 oz)
Copper Layer Thickness
2x copper 0.070mm(70 µm)
1x copper 0.035mm(35 µm)
High Capacity
Ferrite Core
Solid Capacitor 
Power Stage
2x Copper 
Inner Layer 
Signal Layer
Power Layer
New Glass Fabric
Ground Layer
Signal Layer
* Actual component specifications may vary by model
The Benefits of 2 oz Copper PCB design
Better Power
2x Lower
Lower EMI
Better ESD
GIGABYTE’s exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking.

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