MS73-HB0
(rev. 1.x)
4th Gen Intel® Xeon® Scalable DP Motherboard
- 4th Gen Intel® Xeon® Scalable Processors
- Intel® Xeon® CPU Max Series
- Dual processor, LGA 4677
- 8-Channel RDIMM DDR5 per processor, 16 x DIMMs
- Intel® C741 Chipset
- 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
- 2 x 1Gb/s LAN ports (Intel® I210-AT)
- 1 x Dedicated management port
- 3 x SlimSAS with 12 x SATA 6Gb/s ports
- 2 x 7-pin SATA DOM 6Gb/s ports
- 2 x M.2 slots with PCIe Gen4 x4 interface
- 6 x PCIe Gen5 x16 expansion slots
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Board Size
E-ATX
304.8W x 330.2D mm
304.8W x 330.2D mm
Processor Supported
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor, CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Intel® Xeon® CPU Max Series
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor, CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 4677
Socket E
Socket E
Chipset Description
Intel® C741 Chipset
Memory Type
16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
Integrated Network
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
2 x 1Gb/s LAN ports (Intel® I210-AT)
NCSI function supported (by switch setting)
1 x 10/100/1000 management LAN
2 x 1Gb/s LAN ports (Intel® I210-AT)
NCSI function supported (by switch setting)
1 x 10/100/1000 management LAN
Integrated Video Controller
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Integrated Audio Controller
N/A
Integrated SAS Controller
N/A
Integrated SATA Controller
3 x SlimSAS with 12 x SATA 6Gb/s ports
2 x 7-pin SATA DOM 6Gb/s ports
2 x 7-pin SATA DOM 6Gb/s ports
Support RAID Function
Intel® SATA RAID 0/1/10/5
Expansion Slot
Slot_6: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_0
Slot_5: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_1
Slot_4: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_1
Slot_3: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_0
Slot_2: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_0
Slot_1: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_1
2 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Slot_5: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_1
Slot_4: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_1
Slot_3: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_0
Slot_2: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_0
Slot_1: 1 x PCIe x16 (Gen5 x16 bus) slot, from CPU_1
2 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
On-Board Connector
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
2 x 6-pin ATX 12V power connectors
2 x M.2 slots
2 x CPU fan headers
4 x System fan headers
1 x USB 3.2 Gen1 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x HDD backplane board header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Buzzer
2 x 8-pin ATX 12V power connectors
2 x 6-pin ATX 12V power connectors
2 x M.2 slots
2 x CPU fan headers
4 x System fan headers
1 x USB 3.2 Gen1 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x HDD backplane board header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Buzzer
Rear I/O Connectors
2 x USB 3.2 Gen1
1 x VGA
1 x RJ45 COM
4 x RJ45
1 x MLAN
1 x ID button with LED
1 x VGA
1 x RJ45 COM
4 x RJ45
1 x MLAN
1 x ID button with LED
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
OS Driver Supported
Please refer to OS compatibility table in support page
Server Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
PSU Connector
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
2 x 6-pin ATX 12V power connectors
2 x 8-pin ATX 12V power connectors
2 x 6-pin ATX 12V power connectors
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Bundle
1 x MS73-HB0
1 x I/O shield
1 x Quick start guide
6 x Carrier clips
1 x SlimSAS to 4 x SATAIII 6Gb/s cable
Single Box dimensions: 409 x 355 x 78 mm
Carton dimensions: 729 x 415 x 432 mm
Quantity: 10 x single boxes in one carton
1 x I/O shield
1 x Quick start guide
6 x Carrier clips
1 x SlimSAS to 4 x SATAIII 6Gb/s cable
Single Box dimensions: 409 x 355 x 78 mm
Carton dimensions: 729 x 415 x 432 mm
Quantity: 10 x single boxes in one carton
Bulk Packaging Content
10 x MS73-HB0
10 x I/O shields
60 x Carrier clips
Carton dimensions: 600 x 473 x 517 mm
10 x I/O shields
60 x Carrier clips
Carton dimensions: 600 x 473 x 517 mm
Ordering Information
Retail: 9MS73HB0MR-000-1*
Bulk: 9MS73HB0NR-000-1*
Part Numbers: - I/O shield: 12AIO-MD72HB-00R
- SlimSAS to 4 x SATA cable (600mm): 25CFM-600800-A4R
Bulk: 9MS73HB0NR-000-1*
Part Numbers: - I/O shield: 12AIO-MD72HB-00R
- SlimSAS to 4 x SATA cable (600mm): 25CFM-600800-A4R
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.19263.8344
3.5 MB
Jan 16, 2023
作業系統: Windows Server 2019,Windows Server 2022
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver and Utility
Version : 27.8
795.24 MB
Jan 16, 2023
作業系統: Windows Server 2019,Windows Server 2022
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® SATA RAID Utility
Version : 8.0.0.4035
122.34 MB
Jan 17, 2023
作業系統: Windows Server 2019,Windows Server 2022
公用程式
公用程式
版本
檔案大小
日期
Intel® QuickAssist Technology
Version : 2.0.1-0016
37.36 MB
Jan 17, 2023
作業系統: Linux,Windows Server 2019,Windows Server 2022
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.64
111.38 MB
Sep 05, 2023
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2600 AMI)
(AST2600 AMI)
Version : 13.05.04
112.93 MB
Aug 16, 2023
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英語
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