| Description | Version | Size | Date |
|---|
Thông số kỹ thuật
Dimensions (WxHxD, mm)
2U
438 x 87 x 900
438 x 87 x 900
Superchip
2 x liquid-cooled NVIDIA GB200 Grace Blackwell Superchips
Per superchip:
- 1 x NVIDIA Grace™ CPU
- 2 x NVIDIA Blackwell GPUs
- CPU and GPU connected with NVIDIA NVLink™-C2C
- GPU and GPU connected with NVIDIA NVLink™
- GPU TDP up to 1200W
Per superchip:
- 1 x NVIDIA Grace™ CPU
- 2 x NVIDIA Blackwell GPUs
- CPU and GPU connected with NVIDIA NVLink™-C2C
- GPU and GPU connected with NVIDIA NVLink™
- GPU TDP up to 1200W
Memory
NVIDIA Grace™ CPU:
- 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
NVIDIA Blackwell GPU:
- 186GB HBM3E
- Memory bandwidth up to 8TB/s
- 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
NVIDIA Blackwell GPU:
- 186GB HBM3E
- Memory bandwidth up to 8TB/s
LAN
Rear:
4 x 800 Gb/s liquid-cooled OSFP InfiniBand XDR or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™
1 x 1Gb/s LAN (1 x Intel® I210-AT)
- Supports NCSI function
1 x 10/100/1000 Mbps Management LAN
4 x 800 Gb/s liquid-cooled OSFP InfiniBand XDR or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™
1 x 1Gb/s LAN (1 x Intel® I210-AT)
- Supports NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
- 1 x Mini-DP
Storage
Front:
8 x liquid-cooled 2.5" Gen5 NVMe
- (NVMe from ConnectX®-8 SuperNIC™)
Optional front:
4 x liquid-cooled 2.5" Gen5 NVMe
- (NVMe from NVIDIA® BlueField®-3 DPUs) [1]
Internal M.2:
1 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from CPU_1
[1] Requires optional NVIDIA® BlueField®-3 DPU.
8 x liquid-cooled 2.5" Gen5 NVMe
- (NVMe from ConnectX®-8 SuperNIC™)
Optional front:
4 x liquid-cooled 2.5" Gen5 NVMe
- (NVMe from NVIDIA® BlueField®-3 DPUs) [1]
Internal M.2:
1 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from CPU_1
[1] Requires optional NVIDIA® BlueField®-3 DPU.
PCIe Expansion Slots
PCIe Cable x 2:
- 1 x liquid-cooled FHHL x16 (Gen5 x16), from CPU_0, for DPUs
- 1 x FHHL x16 (Gen5 x16), from CPU_1
- 1 x liquid-cooled FHHL x16 (Gen5 x16), from CPU_0, for DPUs
- 1 x FHHL x16 (Gen5 x16), from CPU_1
Front I/O
I/O board:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
12 x Storage activity LEDs
1 x Power button with LED
1 x ID button with LED
1 x Reset button
12 x Storage activity LEDs
Rear I/O
4 x OSFP ports
I/O board:
- 1 x USB 3.2 Gen1 port (Type-A)
- 1 x Micro USB port (for debug only)
- 1 x Mini-DP
- 1 x RJ45 port
- 1 x MLAN port
- 1 x Power button with LED
- 1 x ID button with LED
- 1 x BMC reset button
- 1 x System status LED
- 1 x NVLink status LED
I/O board:
- 1 x USB 3.2 Gen1 port (Type-A)
- 1 x Micro USB port (for debug only)
- 1 x Mini-DP
- 1 x RJ45 port
- 1 x MLAN port
- 1 x Power button with LED
- 1 x ID button with LED
- 1 x BMC reset button
- 1 x System status LED
- 1 x NVLink status LED
Security Modules
RoT and Dual ROM
TPM: CTM013
TPM: CTM013
Power Supply[#1]
4 x 3200W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-220V~/ 16A, 50-60Hz
- 220-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-220V~/ 16A, 50-60Hz
- 220-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Fans
1 x 40x40x56mm
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Weight
Net Weight: 42.8 kg
Gross Weight: 50 kg
Gross Weight: 50 kg
Packaging Dimensions
1178 x 730 x 387 mm
Packaging Content
1 x XN24-VC0-LA61
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NXN24VC0RR000LA61*
- 3-Section Rail kit: 25HB2-UKJH00-K0R
Optional parts:
- Cable Management Arm: 25HB2-2AA700-K0R
- 3-Section Rail kit: 25HB2-UKJH00-K0R
Optional parts:
- Cable Management Arm: 25HB2-2AA700-K0R
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
