TAIPEI, July, 22, 2026 - Giga Computing, a subsidiary of GIGABYTE and a leading provider of enterprise computing and AI infrastructure solutions, has long been committed to advancing data center sustainability and energy efficiency, with Direct Liquid Cooling (DLC) as a key strategic priority.
As thermal design power (TDP) requirements for next-generation processors and AI accelerators continue to rise, Giga Computing is developing more efficient cooling technologies to improve data center power usage effectiveness (PUE) while helping customers maximize system performance. Building on its collaborations with leading liquid cooling partners, Giga Computing is now deepening its work with Fabric8Labs, a pioneer in Electrochemical Additive Manufacturing (ECAM) technology.
ECAM technology makes its debut in Giga Computing’s latest AMD Instinct™ MI355X-powered GPU server platforms, including the G4L3-ZX1 and TO46-ZX1. By advancing from conventional mini-scale designs to ECAM-enabled micro-scale features, it overcomes prior limits on finely optimized three-dimensional structures, eliminating hotspots from high-density heat loads and delivering more uniform chip temperatures.
"ECAM-enabled cold plates are fundamentally changing the thermal landscape for AI servers," said Ian Winfield, Fabric8Labs' Vice President of Product & Applications. "By leveraging pure copper ECAM enabled cold plates, we are delivering the high-performance, custom cooling solutions Giga Computing needs to achieve substantial thermal efficiency gains and confidently meet the relentless power demands of advanced AI accelerators."
“At Giga Computing, we view thermal engineering as a core part of AI system architecture—not an afterthought,” said Canon Yang, CTO of Giga Computing. “The integration of ECAM technology allows us improve cooling efficiency, reduce hydraulic resistance, and optimize infrastructure-level energy performance. This is an important step in scaling next-generation AI platforms more efficiently.”
Looking ahead, Giga Computing will continue expanding its liquid cooling R&D initiatives across future computing platforms, including next-generation AMD CPU and GPU architectures and other advanced computing servers. By integrating Fabric8Labs' pure copper ECAM cold plate technology into its liquid cooling architecture, Giga Computing further strengthens its end-to-end liquid-cooled rack and data center solutions for next-generation AI deployments.
Giga Computing will unveil this ECAM innovation at AMD Advancing AI day, showcasing its collaboration with Fabric8Labs and demonstrating the next evolution of direct liquid cooling. Together, the companies are advancing thermal innovation and setting a new milestone for AI infrastructure cooling efficiency.
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