QBiP-x6413EAT
3.5” SubCompact Wide Temperature Embedded Motherboard with Intel® Atom® x6413E Processor, Dual Channel DDR4 memory, 4 x COM, 1 x SATA 6Gb/s, 4 x USB 3.2 Gen 1, 2 x USB 2.0, Temp -40°C to 85°C
3.5" SBC
Intel® Atom® x6413E
Dual Channel DDR4, 2 x SO-DIMMs
2 x GbE LAN Ports
1 x SATA 6Gb/s Port
M.2 with PCIe x2, SATA 6Gb/s
2 x HDMI, LVDS ports for multiple display
1 x COM Port (RS-232/422/485 & RI/5V/12V)
1 x COM Port (RS-232/422/485)
2 x COM Ports (RS-232)
Wide Temperature Embedded Motherboard
(For more product information, please contact us at sales@gigaipc.com)
(For more product information, please contact us at sales@gigaipc.com)
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SPECIFICATIONS
Board Size
3.5" SBC
146W x 101.7Dmm
146W x 101.7Dmm
Operating Properties
Operating temperature: -40°C to 85°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Processor Supported
Intel® Atom® x6413E Processor
10nm, 4 cores, 4 threads, up to 3.0 GHz
TDP 9W
10nm, 4 cores, 4 threads, up to 3.0 GHz
TDP 9W
Socket
1 x FCBGA1493
Memory Type
2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB
Support Dual channel DDR4 3200 MHz memory modules
Support Dual channel DDR4 3200 MHz memory modules
Integrated Network
2 x GbE LAN Ports (Intel® I210AT)
Integrated Video Controller
Integrated Graphics Processor -
Intel® UHD Graphics for 10th Gen Intel® Processors:
2 x HDMI 2.0 port, supporting a maximum resolution of 4096x2160 @60Hz
1 x LVDS port, supporting a maximum resolution of 1920x1200 @60Hz (3 independent display outputs)
Intel® UHD Graphics for 10th Gen Intel® Processors:
2 x HDMI 2.0 port, supporting a maximum resolution of 4096x2160 @60Hz
1 x LVDS port, supporting a maximum resolution of 1920x1200 @60Hz (3 independent display outputs)
Integrated Audio Controller
Realtek® Audio Codec
Expansion Slot
1 x 2280 M.2 M-Key (PCIe x2, SATA 6Gb/s)
1 x Full-size mini PCIe with SIM slot
1 x Full-size mini PCIe with SIM slot
On Board Connectors
1 x 4-pin box power connector (DC in +9V~36VDC)
1 x SATA Power header
1 x CPU fan header
1 x Front panel header
1 x Front panel audio header
1 x 2W Speaker out header
2 x USB 2.0 headers
1 x COM header (RS-232/422/485 & RI/5V/12V)
1 x COM header (RS-232/422/485)
2 x COM headers (RS-232)
1 x Backlight Control header
1 x AT/ATX mode select jumper
1 x GPIO (8 bits) & SMBus header
1 x Buzzer header
＊Conditional DC-input 9V support with :
(1) SATA_PWR support 5V only
(2) LVDS backlight cannot support
(3) Total power consumption under 50W
1 x SATA Power header
1 x CPU fan header
1 x Front panel header
1 x Front panel audio header
1 x 2W Speaker out header
2 x USB 2.0 headers
1 x COM header (RS-232/422/485 & RI/5V/12V)
1 x COM header (RS-232/422/485)
2 x COM headers (RS-232)
1 x Backlight Control header
1 x AT/ATX mode select jumper
1 x GPIO (8 bits) & SMBus header
1 x Buzzer header
＊Conditional DC-input 9V support with :
(1) SATA_PWR support 5V only
(2) LVDS backlight cannot support
(3) Total power consumption under 50W
Rear I/O Connectors
1 x Headphone Jack
2 x HDMI
2 x RJ45 LAN Ports
4 x USB 3.2 Gen 1
2 x HDMI
2 x RJ45 LAN Ports
4 x USB 3.2 Gen 1
OS Driver Supported
Windows 10 (x64)
Packaging Bundle
Carton size: 375 x 324 x 293 (mm)
Packing Capacity: 10pcs
Single Box size: 256 x 175 x 59 (mm)
Including:
SATA power Cable x 1 (P/N: 25CRI-200B02-K1R)
Fanless Heatsink x 1 (P/N: 25ST1-12311E-A7R)
Packing Capacity: 10pcs
Single Box size: 256 x 175 x 59 (mm)
Including:
SATA power Cable x 1 (P/N: 25CRI-200B02-K1R)
Fanless Heatsink x 1 (P/N: 25ST1-12311E-A7R)
Ordering Information
9MEHLEASMR-SI1 (Box Packing)
Storage
1 x SATA 6Gb/s Port
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
