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NVIDIA Vera Rubin NVL72

GIGAPOD AI DLC POD Scale Solution
  • Built with NVIDIA Vera Rubin Superchips
  • 8 x NVIDIA Vera Rubin NVL72 racks
  • 576 x NVIDIA Rubin GPUs and 288 x NVIDIA Vera CPUs
  • 165.6 TB HBM4 GPU memory
  • Up to 240 kW rack power consumption
  • Reserved space for InfiniBand / Ethernet switches
  • Integrated G-REX cluster-level DLC power and cooling management kit
  • Compatible with GIGABYTE POD Manager software for cluster management / orchestration
  • Supports flexible storage with GIGABYTE storage servers and validated partner solutions
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Configuration

PAC3 Series
Cooling TypeDirect Liquid Cooling
Racks per Scalable Unit
(Compute + Management)
8+12
Rack Height48U
ModelNVIDIA Vera Rubin NVL72
Compute Tray per Rack18 x GIGABYTE XN16-CB0-L01
CPU288 x NVIDIA Vera CPUs
GPU576 x NVIDIA Vera GPUs
SwitchFlexible validated InfiniBand / Ethernet switch configurations
Power Shelves per Rack4 x 3RU 110 kW power shelves
Rack Power ConsumptionUp to 240 kW
CDUIn-Row
CDU SpecificationsIn-Row Liquid-to-Liquid CDU:

Cooling Capacity: 1800 kW (4°C approach temperature)
Primary Loop Connections: 5" clamp interface (inlet/outlet)
Input Power: 2 x IEC 60309 100A (4P5W, 6h plug), AC 380 V ±10% / 3P / 60 Hz

1+1 redundant pumps and redundant A/B power feeds

[Note] The Facility Water System (FWS) loop must meet the water quality values specified in ASHRAE Liquid Cooling Guidelines for Datacom Equipment Centers, 2nd ed., Ch. 5, as reproduced in the ASHRAE TC 9.9 white paper Water-Cooled Servers: Common Designs, Components, and Processes (2019), Table 1.
ManagementIntegrated G-REX DLC power and cooling management kit:
- N120-LS0 management node
- Real-time cluster-level monitoring and control
- Supports Modbus, Redfish, and REST APIs for seamless integration with CDUs and RDHx

Optional GIGABYTE POD Management (GPM) software suite:
- Essential single-node BMC for real-time hardware health and remote system oversight
- Unified cluster-scale management and deep telemetry for high-density deployments
- Total POD-level orchestration for infrastructure provisioning and environmental monitoring
Storage SolutionsFlexible validated partner solutions with GIGABYTE storage servers
 
Cooling Type
Racks per Scalable Unit
(Compute + Management)
Rack Height
Model
Compute Tray per Rack
CPU
GPU
Switch
Power Shelves per Rack
Rack Power Consumption
CDU
CDU Specifications
Management
Storage Solutions
PAC3 Series
Direct Liquid Cooling
8+12
48U
NVIDIA Vera Rubin NVL72
18 x GIGABYTE XN16-CB0-L01
288 x NVIDIA Vera CPUs
576 x NVIDIA Vera GPUs
Flexible validated InfiniBand / Ethernet switch configurations
4 x 3RU 110 kW power shelves
Up to 240 kW
In-Row
In-Row Liquid-to-Liquid CDU:

Cooling Capacity: 1800 kW (4°C approach temperature)
Primary Loop Connections: 5" clamp interface (inlet/outlet)
Input Power: 2 x IEC 60309 100A (4P5W, 6h plug), AC 380 V ±10% / 3P / 60 Hz

1+1 redundant pumps and redundant A/B power feeds

[Note] The Facility Water System (FWS) loop must meet the water quality values specified in ASHRAE Liquid Cooling Guidelines for Datacom Equipment Centers, 2nd ed., Ch. 5, as reproduced in the ASHRAE TC 9.9 white paper Water-Cooled Servers: Common Designs, Components, and Processes (2019), Table 1.
Integrated G-REX DLC power and cooling management kit:
- N120-LS0 management node
- Real-time cluster-level monitoring and control
- Supports Modbus, Redfish, and REST APIs for seamless integration with CDUs and RDHx

Optional GIGABYTE POD Management (GPM) software suite:
- Essential single-node BMC for real-time hardware health and remote system oversight
- Unified cluster-scale management and deep telemetry for high-density deployments
- Total POD-level orchestration for infrastructure provisioning and environmental monitoring
Flexible validated partner solutions with GIGABYTE storage servers

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.