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H173-Z80-IAS1
High Density Server - AMD EPYC™ 9005/9004 - 1U 2-Node DP 4-Bay Gen5 NVMe/SATA/SAS-4 Immersion
- Immersion Cooling Server
- 1U 2-node server system
- Dual AMD EPYC™ 9005/9004 Series Processors per node
- 12-Channel DDR5 RDIMM, 24 x DIMMs per node
- Dual ROM Architecture
- 4 x 1Gb/s LAN ports via Intel® I350-AM2
- 4 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 2 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 2 x LP PCIe Gen5 x16 slots
- 2 x OCP NIC 3.0 PCIe Gen5 x16 slots
- 2 x 3200W 80 PLUS Titanium redundant power supplies
Ordering Numbers: 6NH173Z80DR000ICS1*
Specifications
Dimensions (WxHxD, mm)
1U 2-Node
440 x 43.4 x 855
440 x 43.4 x 855
Motherboard
MZ83-HD2
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Dual processor per node, cTDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 9004 Series Processors
Dual processor per node, cTDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
4 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
48 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
AMD EPYC™ 9005:
RDIMM: Up to 6400 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
12-Channel memory per processor
AMD EPYC™ 9005:
RDIMM: Up to 6400 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Top (I/O board - CLBH160 x 2):
4 x 1Gb/s LAN (2 x Intel® I350-AM2)
- Support NCSI function
2 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
4 x 1Gb/s LAN (2 x Intel® I350-AM2)
- Support NCSI function
2 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in ASPEED® AST2600 x 2
- 2 x Mini-DP
- 2 x Mini-DP
Storage
Bottom hot-swap:
4 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from CPU_1)
- (SATA from CPU_0)
Optional internal M.2 (CMTP192 x 2):
2 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
[1] SAS card is required to support SAS drives.
4 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from CPU_1)
- (SATA from CPU_0)
Optional internal M.2 (CMTP192 x 2):
2 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
PCIe Expansion Slots
Riser Card CRSH01R x 2:
- 2 x LP x16 (Gen5 x16), from CPU_0
2 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
- 2 x LP x16 (Gen5 x16), from CPU_0
2 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Top I/O
I/O board - CLBH160 x 2:
4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x System status LEDs
4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
2 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply[#1]
2 x 3200W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-220V~/ 16A, 50-60Hz
- 220-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-220V~/ 16A, 50-60Hz
- 220-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
ASPEED® AST2600 Baseboard Management Controller
ASPEED® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
ASPEED® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS / BMC / CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Operating Properties
Operating coolant temperature: 20°C to 30°C
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1187 x 733 x 281 mm
Packaging Content
1 x H173-Z80-IAS1
4 x CPU heatsinks
1 x Mini-DP to D-Sub cable
4 x CPU heatsinks
1 x Mini-DP to D-Sub cable
Part Numbers
- Barebone package: 6NH173Z80DR000ICS1*
- Motherboard: 9MZ83HD2UR-000-3*
- CPU heatsink: 25ST1-553204-A0R/25ST1-553205-A0R
- Backplane board - CBP2025: 9CBP2025NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-232004-G1S
Optional parts:
- M.2 expansion card - CMTP192: 6NH273Z82S1000IAW11 (12-in-1)
- Motherboard: 9MZ83HD2UR-000-3*
- CPU heatsink: 25ST1-553204-A0R/25ST1-553205-A0R
- Backplane board - CBP2025: 9CBP2025NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-232004-G1S
Optional parts:
- M.2 expansion card - CMTP192: 6NH273Z82S1000IAW11 (12-in-1)
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical interface values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
