技嘉直接液體冷卻方案是讓運轉中的CPU或GPU等零組件接觸裝滿冷卻液的密封管線,將高效運轉產生的高溫帶出伺服器而達到排解熱能的效果。

直接液體冷卻方案不用安裝氣冷式伺服器所需的電扇與散熱片,可在有限的空間內安裝更多處理器,協助客戶在高密度IT部署獲得總持有成本削減、能耗和噪音降低、並提高系統性能的最佳效益。 

應用領域:
高頻交易
超級擴展運算
人工智慧應用
超級電腦
高效能運算
雲端與邊緣運算


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G593-SD0(LAX1)
HPC/AI Server - 4th/5th Gen Intel® Xeon® Scalable - 5U DP HGX™ H100 8-GPU DLC
Form Factor5U
CPU4th Gen Intel Xeon Scalable or 5th Gen Intel Xeon Scalable or Intel Xeon CPU Max Series
Number of DIMM Slots32
LAN Speed10Gb/s
LAN Ports2
Storage Bays8 x 2.5" bays
PSU6 x 3000W
View Detail of G593-SD0
R183-S90(LAD1)
R183
Form Factor1U
CPU4th Gen Intel Xeon Scalable or 5th Gen Intel Xeon Scalable or AMD EPYC 9004 or Intel Xeon CPU Max Series
Number of DIMM Slots24 or 32
LAN Speed1Gb/s
LAN Ports2
Storage Bays4 x 3.5" bays
PSUDual 1600W
All SKUs of R183
H273-Z80(LAW1)
H273
Form Factor2U 4-Node
CPUAMD EPYC 9004
Number of DIMM Slots96
LAN Speed1Gb/s
LAN Ports8
Storage Bays8 x 2.5" bays or 24 x 2.5" bays
PSUDual 3000W
All SKUs of H273
G363-ZR0(LAX1)
G363
Form Factor3U
CPU4th Gen Intel Xeon Scalable or 5th Gen Intel Xeon Scalable or AMD EPYC 9004 or Intel Xeon CPU Max Series
Number of DIMM Slots16 or 24
LAN Speed10Gb/s + 1Gb/s
LAN Ports2 or 4
Storage Bays8 x 2.5" bays
PSUTriple 3000W
All SKUs of G363
H263-V60(LAW1)
H263
Form Factor2U 4-Node
CPU4th Gen Intel Xeon Scalable or 5th Gen Intel Xeon Scalable or Intel Xeon CPU Max Series or NVIDIA Grace
Number of DIMM Slots64
LAN Speed10Gb/s
LAN Ports0 or 8
Storage Bays8 x 2.5" bays or 16 x 2.5" bays or 24 x 2.5" bays
PSUDual 3000W or Triple 3000W
All SKUs of H263
H262-ZL2(A00)
H262
Form Factor2U 4-Node
CPUAMD EPYC 7002 or AMD EPYC 7003
Number of DIMM Slots64
LAN Speed1Gb/s
LAN Ports8
Storage Bays24 x 2.5" bays
PSUDual 2200W
All SKUs of H262
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