ORV3 GPU Server - Intel® Xeon® 6700/6500 - 8OU DP AMD Instinct™ MI355X - TO86-SX1-AA04

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TO86-SX1-AA04

ORV3 GPU Server - Intel^® Xeon^® 6700/6500 - 8OU DP AMD Instinct^™ MI355X

8 x AMD Instinct^™ MI355X OAM GPUs
Dual Intel^® Xeon^® 6700/6500-Series Processors
8-Channel DDR5 RDIMM / MRDIMM, 32 x DIMMs
2 x 10Gb/s LAN ports via Intel^® X710-AT2
1 x M.2 slot with PCIe Gen5 x4 interface
8 x 2.5" Gen5 NVMe hot-swap bays
12 x FHHL PCIe Gen5 x16 slots
48V to 54V DC Bus Bar power solution

Ordering Numbers: 6NTO86SX1UR000AA04*

儲存

詢價清單

Boosting Individual Applications with On-Point Features

Intel^® Xeon^® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations

Accelerators

built-in*

Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators

8 or 12

Channels

Increased memory frequency and throughput with DDR5 RDIMM support

PCIe 5.0

lanes

Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators

CXL 2.0

support**

Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region

Up to 288

E-cores per CPU

Core dense and optimized efficiency for cloud-native and hyperscale workloads

Intel Xeon 6 Processors with E-cores

Up to 128

P-cores per CPU

Greater core performance with improved TCO, accelerating AI and compute intensive workloads

Intel Xeon 6 Processors with P-cores

MRDIMM

support

Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

Intel Xeon 6 Processors with P-cores

* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the latest Gen Intel Xeon Platform

High CPU Performance

The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.

Energy Efficiency

Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.

Optimal Price

GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.

Ease of Administration

GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.

Continuous Operation

Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.

TO86-SX1-AA04 Block Diagram

TO86-SX1-AA04 Product Overview

High Performance

Supports AMD Instinct™ MI350 Series GPUs

Built on the cutting-edge 4th Gen AMD CDNA™ architecture, the AMD Instinct™ MI350 Series Platforms feature eight GPUs with powerful, energy-efficient cores that maximize performance per watt to drive the next era of AI and HPC innovation. With exceptional efficiency, performance, and memory capacity, the platforms excel at high-speed inference, training massive AI models, and tackling the most complex computational challenges—from scientific simulations to large-scale data processing and advanced modeling.

Empowering Innovation, Built for Open Compute

GIGABYTE OCP ORV3 Compliant Solutions

GIGABTYE is an active member of the OCP, regularly attending the OCP's annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.

GIGABYTE OCP ORV3 Compliant Solutions Advantages

Efficient Rack Density

Optimal design (2OU 2nodes / 2OU 3nodes) - balanced consideration between density and power consumption.

Thermal Optimization

Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
Reduce power consumption of cooling.

Greater Power Efficiency

Low PUE helps reduce data center operating expense.
Central power shelf design to enhance power efficiency and optimize power consumption.

Easy Maintenance

Easier maintenance in front cold aisle instead of hot aisle.
Tool-less design for easy replacement and repair.
Less PSU quantities in whole rack to minimize maintenance efforts.

Higher MTBF

Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
Avoids system downtime caused by component failure and minimizes maintenance efforts.

產品規格

Dimensions (WxHxD, mm)

8OU
537 x 380.5 x 853

Open Rack Version

ORV3

Motherboard

MSJ4-GD0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6700-Series Processors
- Intel^® Xeon^® 6500-Series Processors

Dual processor, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4710
Socket E2

Chipset

System on Chip

Memory

32 x DIMM slots
Support DDR5 RDIMM/MRDIMM^[1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s

^[1]MRDIMMs are supported only on select Intel^® Xeon^® 6 processors with P-cores and only in a 1DPC configuration.

LAN

Front (I/O board):
2 x 10Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Video

Integrated in ASPEED^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1

Modular GPU

8 x AMD Instinct^™ MI355X OAM GPUs

PCIe Expansion Slots

8 x FHHL x16 (Gen5 x16), from PEX89104
4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

I/O board:
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

1 x PRoT connector (only enabled on RoT SKU)

System Management

ASPEED^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

System Fans

Motherboard:
4 x 92x92x38mm

GPU tray:
12 x 92x92x76mm

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Packaging Dimensions

1300 x 800 x 650 mm

Packaging Content

1 x TO86-SX1-AA04
2 x CPU heatsinks
4 x Carriers

No. of Bus Bars

5 x 48V to 54V Bus Bar Connectors

Part Numbers

- Barebone with AMD module: 6NTO86SX1UR000AA04*
- Motherboard: 9MSJ4GD0DR-000*
- Backplane board - CBPG086: 9CBPG086NR-00*
- I/O board - COFP332: 9COFP332NR-00*
- I/O board - COFP340: 9COFP340NR-00*

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