G262-IR0Legacy | Software updates supported

HPC/AI Server - 3rd Gen Intel® Xeon® Scalable - 2U DP HGX™ A100 40GB 4-GPU
  • Supports NVIDIA HGX™ A100 40GB with 4 x SXM4 GPUs
  • Supports NVIDIA® NVLink® technology
  • Up to 600GB/s GPU to GPU interconnection
  • 3rd Gen Intel® Xeon® Scalable Processors
  • Dual processor, 10nm technology
  • 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
  • Intel® C621A Chipset
  • Dual ROM Architecture
  • 1 x Dedicated management port
  • 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 6 x LP PCIe Gen4 x16 slots
  • 1 x OCP 3.0 Gen4 x16 slot
  • Dual 3000W 80 PLUS Platinum redundant power supply
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  • 產品介紹
  • 產品規格
  • 支援與下載
  • 相關資源

產品規格

Dimensions (WxHxD, mm)
2U
448 x 86.8 x 800
Motherboard
MH62-HD2
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 4189
Socket P+
Chipset
Intel® C621A Chipset
Memory
16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
Front side:
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX88096

SAS card is required for SAS devices support
SAS
Depends on SAS add-on card
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
NVIDIA HGX™ A100 40GB with 4 x SXM4 GPUs

1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_1
4 x PCIe x16 (Gen4 x16) low-profile slots on rear side, from PEX88096

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function by onboard NCSI_SW
Internal I/O
1 x TPM header
1 x Front panel header
1 x OCP 3.0 slot
Front I/O
2 x USB 3.0
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply[#1]
Dual 3000W 80 PLUS Platinum redundant power supply

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-240V~/ 15.8A, 50-60Hz

DC Input:
- 240Vdc/ 14A

DC Output:
- Max 1200W/ 100-127V~
+ 54V/ 95.6A
+ 12Vsb/ 3.5A
- Max 3000W/ 200-240V~
+ 54V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later

Citrix Hypervisor 8.2.0 or later
System Fans
2 x 60x60x76mm (21,700rpm)
5 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25 kg
Packaging Dimensions
1077 x 679 x 300 mm
Packaging Content
1 x G262-IR0
2 x CPU fansinks
1 x L-shape Rail kit
Part Numbers
- Barebone w/ 40GB module: 6NG262IR0DR-00-1*
- Motherboard: 9MH62HD2NR-00
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU fansink: 25ST1-453100-M1R/25ST1-453101-M1R
- GPU heatsink: 25ST1-2532G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-667630-S1R
- Fan module: 25ST2-808034-S1R
- Fan module: 25ST2-808035-S1R
- Riser card - CRSG230: 9CRSG230NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- PCIe extension board - CPBG740: 9CPBG740NR-00
- Power supply: 25EP0-230003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG262IR0SR-RMA-A100

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。

[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。

[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。

[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

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