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- G593-SD0
G593-SD0
(rev. AAX1)
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP HGX™ H100 8-GPU 4-Root Port
- NVIDIA-Certified System - Data Center Server
- NVIDIA HGX™ H100 with 8 x SXM5 GPUs
- 900GB/s GPU-to-GPU bandwidth with NVLink® and NVSwitch™
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel RDIMM DDR5, 32 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA® BlueField®-2 DPUs
- 2 x 10Gb/s BASE-T LAN ports via Intel® X710-AT2
- 8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays
- 12 x LP PCIe Gen5 x16 slots
- 1 x LP PCIe Gen4 x16 slot
- 4+2 3000W 80 PLUS Titanium redundant power supplies
Get a Quote
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
5U
447 x 222.25 x 945
447 x 222.25 x 945
Motherboard
MSB3-G40
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
LAN
Front side:
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX89104
SAS card is required for SAS devices support
8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX89104
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
NVIDIA HGX™ H100 with 8 x SXM5 GPUs
8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Internal I/O
1 x TPM header
1 x VROC connector
1 x VROC connector
Front I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
1 x MLAN
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Red Hat Enterprise Linux 8.6 or later (x86_64)
Windows Server 2022 (x64)
Additional certifications:
Red Hat Enterprise Linux 8.6 or later (x86_64)
Windows Server 2022 (x64)
System Fans
Motherboard:
2 x 40x40x28mm (25,000rpm)
4 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
3 x 40x40x56mm (29,700rpm)
GPU tray:
6 x 60x60x76mm (21,700rpm)
6 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,200rpm)
2 x 40x40x28mm (25,000rpm)
4 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
3 x 40x40x56mm (29,700rpm)
GPU tray:
6 x 60x60x76mm (21,700rpm)
6 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,200rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1200 x 890 x 700 mm
Packaging Content
1 x G593-SD0-AAX1
2 x CPU heatsinks
6 x Carrier clips
1 x L-shape Rail kit
2 x CPU heatsinks
6 x Carrier clips
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module (5/4th Gen): 6NG593SD0DR000ABX1*
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD0DR000AAX1*
- Motherboard: 9MSB3G40NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU heatsink: 25ST1-24320H-M1R
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Fan module 80x80x80mm: 25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- I/O board - CDB66: 9CDB66NR-00
- PCIe extension board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- G-SCM board - CDCG120: 9CDCG120UR-00
- Power supply: 25EP0-23000N-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD0DR000AAX1*
- Motherboard: 9MSB3G40NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU heatsink: 25ST1-24320H-M1R
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Fan module 80x80x80mm: 25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- I/O board - CDB66: 9CDB66NR-00
- PCIe extension board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- G-SCM board - CDCG120: 9CDCG120UR-00
- Power supply: 25EP0-23000N-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver
Version : 28.2.1
776.69 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
RAID
RAID
版本
檔案大小
日期
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
公用程式
BIOS
說明
版本
檔案大小
日期
Include INTEL-TA-01036 (CVE-2023-45745/CVE-2023-47855); AMI SA50232 (CVE-2023-45236/CVE-2023-45237), and multiple feature updates.
Version : R09
29.63 MB
Apr 12, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.73
147.86 MB
Mar 05, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
(AST2600)
Version : 13.05.09
113.83 MB
Jan 26, 2024
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英語
說明
版本
檔案大小
日期
作業系統支援列表
Version : 1.5
0.22 MB
Jan 04, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
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