* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87.5 x 840
Motherboard
MP62-HD0
CPU
Ampere® Altra® Max or Altra® Processor
Dual processors, 7nm technology
Up to 128-core per processor

NOTE:
If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4926
Total:
8 x LGA 4926
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 256GB supported
LRDIMM modules up to 256GB supported
Up to 4TB of memory capacity supported per processor
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio
N/A
Storage
Per node:
6 x 2.5" SATA hot-swappable HDD/SSD bays

Total:
24 x 2.5" SATA hot-swappable HDD/SSD bays
SAS
N/A
RAID
N/A
Peripheral Drives
N/A
Expansion Slots
Per node:
2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth*

1 x M.2 slot:
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

Total:
8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth*

4 x M.2 slots:
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

NOTE: Gen4 x16 available for Ampere Altra Max processor only
Internal I/O
Per node:
1 x M.2 slot
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
*1 x CMC status LED

*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x Mini DP
2 x RJ45
1 x RJ45 MLAN

Total:
8 x USB 3.0
4 x Mini DP
8 x RJ45
4 x RJ45 MLAN
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O
Total 24 x ports, each node handles 6 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

System power supply requires C19 type power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Red Hat Enterprise Linux 8.3 ( ARM64)

CentOS 8.3-2011 (ARM64)

SUSE Linux Enterprise Server 15 SP2 ( ARM64)

Ubuntu 18.04.5-server (ARM64)
Ubuntu 20.04.1-legacy-server (ARM64)

Fedora Server 33-1.2 (ARM64)

FreeBSD 13.0 current (ARM64)

OracleLinux R8 U2 (ARM64)

Debian 10.9 (Buster) (ARM64)
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-P60
8 x CPU heatsinks
1 x Rail Kit
Part Numbers
Barebone package: 6NH262P60MR-00
Spare parts:
- Motherboard: 9MP62HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: TBD
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-222003-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (in option)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (in option)
- Ring topology kit: 6NH262Z65SR-00-100 (in option)
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

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