| 描述 | 版本 | 檔案大小 | 日期 |
|---|
1/6
H262-PC1
HCI Server - 3rd Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS
- 2U 4-node rear access server system
- 3rd Gen Intel® Xeon® Scalable Processors
- Dual processor per node, 10nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- Supports Intel® Optane™ Persistent Memory 200 series
- Dual ROM Architecture
- Intel® C621A Chipset
- 8 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
- 4 x Dedicated management ports
- 1 x CMC port
- 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 8 x LP PCIe Gen4 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
產品規格
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MH62-HD1
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W
Please leave one PCIe slot empty if using processor with 270W TDP
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Dual processor per node, 10nm technology
CPU TDP up to 270W
Please leave one PCIe slot empty if using processor with 270W TDP
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
Chipset
Intel® C621A Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
Per node:
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
NCSI function supported
1 x Dedicated management port
Total:
8 x 10GbE BASE-T LAN ports (4 x Intel® X710-AT2)
NCSI function supported
4 x Dedicated management ports
1 x CMC port
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
NCSI function supported
1 x Dedicated management port
Total:
8 x 10GbE BASE-T LAN ports (4 x Intel® X710-AT2)
NCSI function supported
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
SAS card is required for SAS devices support
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
SAS card is required for SAS devices support
SAS
Depends on SAS add-on card
RAID
Intel® SATA RAID 0/1
Expansion Slots
Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*
Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*
*NOTE: OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 Gen3 x16 bandwidth is needed.
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*
Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*
*NOTE: OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 Gen3 x16 bandwidth is needed.
Internal I/O
Per node:
1 x COM header
1 x SATA 7-pin connector
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x COM header
1 x SATA 7-pin connector
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply[#1]
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
AMI MegaRAC SP-X Solution Web interface
AMI MegaRAC SP-X Solution Web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C*
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 27.2 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-PC1
8 x CPU heatsinks
1 x 3-Section Rail kit
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262PC1MR-00-1*
- Motherboard: 9MH62HD1NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Riser card - CRSH01D: 9CRSH01DNR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- LAN board - CLBH020: 9CLBH020NR-00
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262PC1SR-RMA-A100
- Motherboard: 9MH62HD1NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Riser card - CRSH01D: 9CRSH01DNR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- LAN board - CLBH020: 9CLBH020NR-00
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262PC1SR-RMA-A100
[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件)，或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
