H262-Z66

2U 4-Node - Rear access
440 x 87.5 x 840

MZ62-HD0 Rev. 3.0

AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors

Dual processor per node, TDP up to 200W

^[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

^[Note] Contact our sales representatives or technical support for more details about supporting cTDP 240W CPUs.

8 x LGA 4094
Socket SP3

System on Chip

64 x DIMM slots
DDR4 memory supported
8-Channel memory per processor
RDIMM/LRDIMM: Up to 3200 MT/s

Rear:
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN
1 x CMC port

Integrated in ASPEED^® AST2500 x 4
- 4 x VGA ports

Front hot-swap:
12 x 2.5" Gen3 NVMe/SATA/SAS ^[1]
12 x 2.5" SATA/SAS ^[1]

Internal M.2:
4 x M.2 (2242/2260/2280/22110), PCIe Gen3 x4, from CPU_0 ^[2]
4 x M.2 (2242/2260/2280/22110), PCIe Gen3 x4, from CPU_1 <sup>[2]

[1]</sup> SAS card is required to support SAS drives.

^[2] CPU TDP is limited to 155W when using M.2 drives.

Require SAS add-in cards

Require RAID add-in cards

8 x LP x16 (Gen4 x16), from CPU_0

4 x OCP 2.0 mezzanine (Gen3 x16), from CPU_0 (Type1, P1, P2, P3, P4)
- Support NCSI function

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED

8 x USB 3.0 ports (Type-A)
4 x VGA ports
8 x RJ45 ports
4 x MLAN ports
1 x CMC port

Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Dual 2200W 80 PLUS Platinum redundant power supply ^[1]

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

^[1] The system power supply requires C19 power cord.

ASPEED^® AST2500 Baseboard Management Controller
ASPEED^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Net Weight: 47.63 kg
Gross Weight: 49.63 kg

1180 x 779 x 300 mm

1 x H262-Z66
8 x CPU heatsinks
1 x 3-Section Rail kit

- Barebone package: 6NH262Z66MR-00-A*
- Motherboard: 9MZ62HD0NR-00*
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CFPH004: 9CFPH004NR-00*
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00*
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z66SR-RMA-A100