R263-Z32- AAV1

Rack Server - AMD EPYC™ 9004 - 2U UP 24-Bay Gen4 NVMe/SATA/SAS (12 x NVMe) Titanium
  • Single AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology)
  • 12-Channel DDR5 RDIMM, 12 x DIMMs
  • Dual ROM Architecture
  • 1 x 1Gb/s LAN port via Intel® I210-AT
  • 12 x 2.5" Gen4 NVMe hot-swappable bays
  • 12 x 2.5" SATA/SAS hot-swappable bays
  • 1 x M.2 slot with PCIe Gen3 x4 interface
  • 2 x FHHL PCIe Gen5 x16 slots
  • 2 x OCP 3.0 Gen5 x16 slots
  • 1+1 1600W 80 PLUS Titanium redundant power supplies
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U
438 x 87.5 x 710
Motherboard
MZ33-DC0
CPU
AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128 cores, 256 threads
cTDP up to 300W at ambient 35°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Socket
1 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
12 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
LAN
Rear side:
1 x 1Gb/s LAN port (1 x Intel® I210-AT)
Supports NCSI function

1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
12 x 2.5" Gen4 NVMe hot-swappable bays
12 x 2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
N/A
Expansion Slots
Riser Card CRS201H:
- 1 x PCIe x16 (Gen5 x16) FHHL slot

Riser Card CRS201M:
- 1 x PCIe x16 (Gen5 x16) FHHL slot

2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4
- Supports 2280/22110 cards
Internal I/O
1 x TPM header
Front I/O
2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs (1 x LED disabled)
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
1+1 1600W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-240V~/ 12-9.5A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 9.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12.2V/ 131.2A
+12Vsb/ 3A

Note: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
VMware ESXi 8.0 or later
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
989 x 594 x 279 mm
Packaging Content
1 x R263-Z32-AAV1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR263Z32DR000AAV1*
- Motherboard: 9MZ33DC0UR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-143100-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP20O7: 9CBP20O7NR-00
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201H: 9CRS201HNR-00
- Riser card - CRS201M: 9CRS201MNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-21600E-L0S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
網路介面
BIOS
說明
版本
檔案大小
日期
1) Update to Genoa AGESA 1.0.0.C.
2) Security updates: CVE-2023-31315, CVE-2023-31355, CVE-2024-21978, CVE-2024-21980.
3) Multiple feature updates.
Version : F22
20.93 MB
Jul 11, 2024
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
說明
版本
檔案大小
日期

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