G191-H44

End of Support

HPC Server - 4 x GPU Card Slots
  • Supports 5G network infrastructure
  • Up to 4 x NVIDIA® Tesla® PCIe GPGPU cards
  • NVIDIA® NGC™ Ready server
  • 2nd Gen. Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
  • 6-Channel RDIMM/LRDIMM DDR4, 24 x DIMMs
  • Supports Intel® Optane™ DC Persistent Memory
  • Dual 1Gb/s LAN ports (Intel® I350-AM2)
  • 2 x 2.5" hot-swappable + 2 x 2.5" internal fixed HDD/SSD bays
  • 2 x low profile PCIe Gen3 expansion slots
  • 2 x 80 PLUS Platinum 2000W redundant PSU
  • Optimized performance with Mellanox Infiniband and Ethernet 100G products
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產品規格

Dimensions (WxHxD, mm)
1U
430 x 43.5 x 975 mm
Motherboard
MG31-G10
CPU
2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 205W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 3647
Socket P
Chipset
Intel® C621 Chipset
Memory
24 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x12 pcs

DCPMM installation locations:
DIMM_P0_(A1, B1, C1)
DIMM_P0_(D1, E1, F1)
DIMM_P1_(G1, H1, I1)
DIMM_P1_(J1, K1, L1)

NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
LAN
2 x GbE LAN ports (Intel® I350-AM2)
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
2 x 2.5" hot-swappable HDD/SSD bays
2 x 2.5" internal fixed HDD/SSD bays
SAS card is required for SAS devices support
SATA
4 x SATA III 6Gb/s ports
SAS
Depends on SAS add-on Card
RAID
Intel® SATA RAID 0/1/5/10
Peripheral Drives
N/A
Expansion Slots
4 x Full-length full-height x16 slots (Gen3 x16 bus) for GPU cards

2 x half-length low-profile slots
- 2 x PCI-e x16 slot (Gen3 x16 bus)*
* PCIe Gen3 x8 shared with 2 x U.2 ports (optional)

- System must be operated under 30°C when 4 x Tesla PCIe GPUs are installed with a 173W or higher CPU
- System is validated for population with a uniform GPU model
- Support is not provided for mixed GPU populations
Internal I/O
2 x CRPS power connectors
2 x RJ45 LAN connectors
1 x TPM header
1 x Front VGA header
1 x Clear CMOS jumper
1 x ME update jumper
Front I/O
2 x USB 3.0
2 x RJ45
1 x MLAN
1 x VGA
1 x Serial
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x HDD activity LED
Rear I/O
N/A
Backplane Board
2 x SATA/SAS ports
Bandwidth: SATAIII 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply[#1]
2 x 2000W redundant PSU
80 PLUS Platinum

AC Input:
- 100-120V~/ 12A, 50-60Hz
- 180-240V~/ 10A, 50-60Hz

DC Input:
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+ 12.2V/ 81.5A
+ 12Vsb/ 2.5A
- Max 1600W/ 180-199V~
+ 12.2V/ 131A
+ 12Vsb/ 2.5A
- Max 1800W/ 200-220V~
+ 12.2V/ 147.5A
+ 12Vsb/ 2.5A
- Max 2000W/ 221-240V~
+ 12V/ 163.5A
+ 12Vsb/ 2.5A
System Management
Aspeed® AST2500 management controller
Avocent® MergePoint IPMI 2.0 web interface:
  • Network settings
  • Network security settings
  • Hardware information
  • Users control
  • Services settings
  • IPMI settings
  • Sessions control
  • LDAP settings
  • Power control
  • Fan profiles
  • Voltages, fans and temperatures monitoring
  • System event log
  • Events management (platform events, trap settings, email settings)
  • Serial Over LAN
  • vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
11 x 40x40x56mm (25,000rpm)
3 x 40x40x28mm (25,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

NOTE: Please contact Technical Support for more information about optimized GPU system operating temperature
Weight
Net Weight: 15.7 kg
Gross Weight: 26.84 kg
Packaging Dimensions
1145 x 195 x 748 mm
Packaging Content
1 x G191-H44
2 x CPU heatsinks
1 x Rail kit
Part Numbers
- Barebone package: 6NG191H44MR-00-200
- Rail kit: 25HB2-NJ2101-N1R
- CPU heatsink: 25ST1-253100-F2R
- Back plane board: 9CBPG021NR-00
- Front IO board: 9CFPG013NR-00
- Fan module (40x28): 25ST2-442827-D0R
- Fan module (40x56): 25ST2-405620-D0R/25ST2-44562X-D0R/25ST2-44562Y-D0R/25ST2-44562Z-D0R
- Power supply: 25EP0-220009-L0S
- NVMe cable for U.2 support: 25CFM-300801-A4R (optional)

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。

[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。

[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。

[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

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