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ORV3 Compute Node - AMD EPYC™ 9005 - 2OU 2-Node DP 8-Bay E3.S Gen5 NVMe + 2-Bay E1.S Gen3 NVMe - TO25-ZM0-AA01
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ORV3 Compute Node - AMD EPYC™ 9005 - 2OU 2-Node DP 8-Bay E3.S Gen5 NVMe + 2-Bay E1.S Gen3 NVMe - TO25-ZM0-AA01

TO25-ZM0-AA01

ORV3 Compute Node - AMD EPYC™ 9005 - 2OU 2-Node DP 8-Bay E3.S Gen5 NVMe + 2-Bay E1.S Gen3 NVMe
  • Dual AMD EPYC™ 9005 Series Processors
  • 12-Channel DDR5 RDIMM, 24 x DIMMs
  • Hardware Root of Trust
  • 2 x 1 Gb/s LAN ports via Intel® I350-AM2
  • 8 x E3.S Gen5 NVMe hot-swap bays
  • 2 x E1.S Gen3 NVMe hot-swap bays
  • 2 x LP PCIe Gen5 x16
  • 4 x OCP NIC 3.0 SFF PCIe Gen5 x16
  • 48 V to 54 V DC bus bar power solution
Ordering Numbers: 6NTO25ZM0RR000AA01*
AMD EPYC
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New AMD EPYC™ Family of Processors
 Same Great SP5 Platform

The SP5 socket has reached its pinnacle form with 5th Generation AMD EPYC™ processors. The same successful platform that was shared by AMD EPYC™ 9004 & 8004 series processors is now the same one for AMD EPYC™ 9005 series processors. With up to 192 cores, increased frequencies and cache, this top tier performance platform targets general purpose, cloud native, and technical computing. Building on the advantages of the EPYC™ 9004 series, the new EPYC™ 9005 series adopts the 3nm process with AMD “Zen5” and “Zen5c” core architecture, excelling in both energy efficiency and cost optimization. GIGABYTE has already prepared for this new processor with new servers and updates to existing products for 4th Gen AMD EPYC™ processors.
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5th Generation AMD EPYC™ Processors for SP5 Socket

3nm
architecture
Increased transistor density alongside a reduction in power consumption
Up to 192
CPU cores
Dedicated “Zen 5” & “Zen 5c” cores increase compute density
Up to 512MB
L3 cache
An L3 cache increase helps to reduce latency in data-intensive operations
12
channels
Memory capacity up to 9TB in a 2 DIMM per channel configuration
Up to 160
PCIe lanes
Dual socket configuration adds a significant amount of I/O connectivity
CXL 2.0
support
Disaggregated compute architecture possible via Compute Express Link
• AMD EPYC™ 9005 Series processors require OEM enablement and a BIOS update from your server or motherboard manufacturer if used with a motherboard designed for the SP5 socketed AMD EPYC™ 9004 Series processors. Contact your system manufacturer prior to purchase to determine compatibility.
• CXL Type 1&2 devices and PCIe link encryption support dependent upon ecosystem readiness; type 2 PoC only.
• CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the AMD EPYC™ 9005 Platform

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High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads while supporting the latest GPU and CXL technology.
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Compute Density

With 192 CPU cores per socket, GIGABYTE's 4-node servers support up to 1,536 CPU cores, allowing a far greater number of concurrent tasks to be done.
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Fast & Stable Connectivity

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for fast PCIe 5.0 speeds.
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Collaboration

AMD and GIGABYTE have maintained a healthy relationship that values shared knowledge and open communication in order to launch products in tandem.
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Optimal Price

Our broad portfolio of products tailored to applications allow customers to only select server features they require while doing so at a lower TCO.

TO25-ZM0-AA01 Block Diagram

Empowering Innovation, Built for Open Compute

GIGABYTE OCP ORV3 Compliant Solutions

GIGABTYE is an active member of the OCP, regularly attending the OCP's annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.
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GIGABYTE OCP ORV3 Compliant Solutions Advantages

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Efficient Rack Density

  • Optimal design (2OU 2nodes / 2OU 3nodes) - balanced consideration between density and power consumption.
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Thermal Optimization

  • Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
  • Reduce power consumption of cooling.
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Greater Power Efficiency

  • Low PUE helps reduce data center operating expense.
  • Central power shelf design to enhance power efficiency and optimize power consumption.
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Easy Maintenance

  • Easier maintenance in front cold aisle instead of hot aisle.
  • Tool-less design for easy replacement and repair.
  • Less PSU quantities in whole rack to minimize maintenance efforts.
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Higher MTBF

  • Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
  • Avoids system downtime caused by component failure and minimizes maintenance efforts.

Specifications

Dimensions (WxHxD, mm)
2OU 2-Node
263 x 91.2 x 755
Open Rack Version
ORV3
Motherboard
MZM3-OP0
CPU
AMD EPYC™ 9005 Series Processors

Dual processor, cTDP up to 400 W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Memory
24 x DIMM slots
Support DDR5 RDIMM
12-Channel memory per processor
Up to 6400 MT/s
LAN
Front (I/O board):
2 x 1 Gb/s LAN (2 x Intel® I350-AM2)
1 x 10/100/1000 Mb/s Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
Storage
Front hot-swap:
8 x E3.S Gen5 NVMe
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1)
2 x E1.S Gen3 NVMe
- (PCIe Gen3 x4 shared, from SAS3808N)
RAID
Supports RAID 0/1 on E1.S drives
Require RAID add-in cards
PCIe Expansion Slots
PCIe Cable x 2:
- 1 x LP x16 (Gen5 x16), from CPU_0
- 1 x LP x16 (Gen5 x16), from CPU_1

OCP Module x 4:
2 x OCP NIC 3.0 SFF (Gen5 x16), from CPU_0
- OCP_1 supports NCSI function
2 x OCP NIC 3.0 SFF (Gen5 x16), from CPU_1
Front I/O
I/O board:
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x BMC reset button
1 x System status LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM010
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
System Fans
N/A
Compatible Node Tray
TO25-BT1-AA01
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1170 x 770 x 296 mm
Packaging Content
1 x TO25-ZM0-AA01
2 x CPU heatsinks
Part Numbers
- Barebone package: 6NTO25ZM0RR000AA01*
- Motherboard: 9MZM3OP0UR-000*
- Backplane board - COBP520: 9COBP520NR-00*
- Backplane board - COBP880: 9COBP880NR-00*
- I/O board - COFP33A: 9COFP33ANR-00*
- I/O board - COFP340: 9COFP340NR-00*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.

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