TO46-SD3-LA07 Open Compute Project

Boosting Individual Applications with On-Point Features

Intel^® Xeon^® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations

Accelerators

built-in*

Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators

8 or 12

Channels

Increased memory frequency and throughput with DDR5 RDIMM support

PCIe 5.0

lanes

Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators

CXL 2.0

support**

Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region

Up to 288

E-cores per CPU

Core dense and optimized efficiency for cloud-native and hyperscale workloads

Intel Xeon 6 Processors with E-cores

Up to 128

P-cores per CPU

Greater core performance with improved TCO, accelerating AI and compute intensive workloads

Intel Xeon 6 Processors with P-cores

MRDIMM

support

Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

Intel Xeon 6 Processors with P-cores

* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Why Choose GIGABYTE Liquid Cooling Servers?

Cool Performance

Servers will run incredibly stable and have high-performance from liquid cooled components that operate well below CPU TDP.

Power Saving

A liquid cooled server with less fans and running at lower speeds can achieve the same performance as an air-cooled server while consuming less power.

Noise Reduction

Servers require a lot of high-speed, high noise fans. GIGABYTE has found a way to reduce the noise by reducing the number of fans while using a liquid cooling solution.

Proven Track Record

The direct liquid cooling system supplier has 20 years of experience in cooling solutions for desktops PCs & data centers. GIGABYTE has 20+ years of experience as well.

Reliability

Liquid cooling solutions can be monitored with little need for maintenance. GIGABYTE manifold and cold plate components are covered under standard warranty.

Ease of Use

GIGABYTE servers paired with a liquid cooling kit can be mounted in a rack or connected to a building’s water system. And offers quick/easy/dry disconnects.

TO46-SD3-LA07 Block Diagram

TO46-SD3-LA07 Block Diagram

TO46-SD3-LA07 Block Diagram

High Performance

Supports NVIDIA HGX™ B300

NVIDIA HGX™ B300 is built for the age of AI reasoning with enhanced compute and increased memory. Featuring 7X more AI compute than Hopper platforms, 2.1TB of HBM3E memory, and high-performance networking integration with NVIDIA^® ConnectX^®-8 SuperNICs, Blackwell Ultra delivers breakthrough performance on the most complex workloads from agentic systems and reasoning, to real time video generation for every data center.

Empowering Innovation, Built for Open Compute

GIGABYTE OCP ORV3 Compliant Solutions

GIGABTYE is an active member of the OCP, regularly attending the OCP's annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.

GIGABYTE OCP ORV3 Compliant Solutions Advantages

Efficient Rack Density

Optimal design (2OU 2nodes / 2OU 3nodes) - balanced consideration between density and power consumption.

Thermal Optimization

Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
Reduce power consumption of cooling.

Greater Power Efficiency

Low PUE helps reduce data center operating expense.
Central power shelf design to enhance power efficiency and optimize power consumption.

Easy Maintenance

Easier maintenance in front cold aisle instead of hot aisle.
Tool-less design for easy replacement and repair.
Less PSU quantities in whole rack to minimize maintenance efforts.

Higher MTBF

Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
Avoids system downtime caused by component failure and minimizes maintenance efforts.

TO46-SD3-LA07

Boosting Individual Applications with On-Point Features

Core Technology Aligned with Aspirations

Why Choose GIGABYTE Liquid Cooling Servers?

Cool Performance

Power Saving

Noise Reduction

Proven Track Record

Reliability

Ease of Use

TO46-SD3-LA07 Block Diagram

TO46-SD3-LA07 Block Diagram

TO46-SD3-LA07 Block Diagram

High Performance

Empowering Innovation, Built for Open Compute

GIGABYTE OCP ORV3 Compliant Solutions

GIGABYTE OCP ORV3 Compliant Solutions Advantages

Efficient Rack Density

Thermal Optimization

Greater Power Efficiency

Easy Maintenance

Higher MTBF

Support

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