Specifications
Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87 x 820
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Note: This device does not support Intel Omni-Path function.
Socket
Per Node:
2 x LGA 3647
Total:
4 x LGA 3647
Socket P
Memory
Per node:
16 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
*Ambient temperature 35°C
*2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
*DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s memory is supported only with 2nd Generation Intel® Xeon® Scalable Processors.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Per node:
1 x 10/100/1000 Mbps Management port
Total:
2 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port
Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.
Video
Integrated in Aspeed® AST2500 x 2
- 2 x VGA ports
Storage
Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
10 x 2.5" SATA/SAS hot-swappable bays
1 x Broadcom SAS35x24R expander
Default configuration supports:
2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays
2 x Broadcom SAS35x24R expander
Default configuration supports:
4 x U.2 and 0 x SAS/SATA drives
SAS card is required to enable the drive bays
RAID
For SATA drives:
Intel® SATA RAID 0/1/5/10
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1
Note: VROC module is for Intel® SSD only.
Expansion Slots
Per node:
1 x PCIe x16 (Gen3 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Total:
2 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs
2 x PCIe x16 (Gen3 x16) low-profile slots
2 x PCIe x8 (Gen3 x8) low-profile slots
2 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth
Note: For the latest GPU QVL, please contact your GIGABYTE representative.
Internal I/O
Per node:
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
4 x USB 3.0
2 x VGA
2 x MLAN
2 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
-
Optional TPM2.0 kit:
CTM000Power Supply[#1]
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
System Management
Aspeed
® AST2500 Baseboard Management Controller
Aspeed
® AST1250 Chassis Management Controller
(-100/A00)
Aspeed
® AST2520 Chassis Management Controller
(-B00)
Avocent
® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Hardware information
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Fan profiles
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note: Please contact Technical Support for more information about optimized GPU system operating temperature.
Weight
30 kg (full packaging)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H231-H60
4 x CPU heatsinks
1 x Rail kit
1 x VROC module
4 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH231H60MR-00*
- Motherboard: 9MH61HD5NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit:
6NH23NR48SR-00 [#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.