Rack Server - AMD EPYC™ 9006 SP7 Server Processors - 2U UP 20-Bay E3.S Gen6 NVMe - R265-DG3-AS1

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R265-DG3-AS1

Rack Server - AMD EPYC^™ 9006 SP7 Server Processors - 2U UP 20-Bay E3.S Gen6 NVMe

Storage Networking Hybrid/Private Cloud Server

Single AMD EPYC^™ 9006 SP7 Server processors
16-Channel DDR5 RDIMM/MRDIMM per CPU with 16 x DIMMs
2 x 1 Gb/s LAN ports via Intel^® I350-AM2
20 x E3.S Gen6 NVMe hot-swap bays
2 x M.2 slots with PCIe Gen4 x2
1 x FHFL PCIe x16 slot with Gen6 x16 lanes
2 x 3200 W 80 PLUS Titanium redundant power supplies

Ordering Numbers: 6NR265DG3HR000AS1*

Caractéristiques

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6th Generation AMD EPYC™ Processors for SP7 Socket

DDR5 channels

Delivering up to 1.6TB/s memory bandwidth in 1DPC (MRDIMMs)

Up to 256

CPU cores

More VMs per rack and more tasks done with less real estate

Zen6 & Zen6c

Cores

Optimized core package to achieve high frequency or high density

CXL 3.1

Support

Multi-host memory sharing and P2P over fabric at double data rate

PCIe Gen6

Lanes

2x per-lane bandwidth vs Gen5, for next-gen GPUs, NICs, and storage

2nm

Architecture

Smaller process node boosts core density and efficiency per watt

Select GIGABYTE for the AMD EPYC™ 9006 Platform

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads such as high frequency training and scientific simulation.

Advanced Cooling

GIGABYTE's cooling solutions utilize diverse technologies and system designs, purpose built to keep demanding workloads performing at their peak.

Fast and Stable Connectivity

Keeping pace with the challenges for next gen technology, GIGABYTE boards provide users the signal integrity for PCIe 6.0 speeds and I/O flexibility.

Optimal Price

A broad portfolio tailored to specific applications lets customers select only the features a workload needs, keeping total cost of ownership down.

Memory Bandwidth

GIGABYTE boards support the maximum 32-channel DDR5 subsystem EPYC 9006 offers running at up to 12800 MT/s (MRDIMMs). Expertly crafted layouts ensure bandwidth remains stable under heavy workloads.

R265-DG3-AS1 Block Diagram

Power Efficiency

Automatic Fan Speed Control

GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

Hardware Security

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

System Management

Enhanced HPC & AI Management with AST2700

The AST2700 delivers increased performance and efficiency over previous generations. It is built to support high-density multi-node HPC and AI systems, with enhanced CMC to BMC communication reducing retransmissions and IPMB signal interference. In addition, it comes equipped with the management and diagnostic tools operators need to recover quickly when issues arise.

Firmware rollback across the last five BMC and BIOS versions
Dual OS ISO storage for remote recovery and Virtual Media installation
Full BMC process logging for diagnostics

User Friendly

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.

Certified Ready with Software Partners

Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.

High Availability

Smart Ride Through (SmaRT)

To prevent server downtime and data loss as a result of loss of AC power, GIGABYTE implements SmaRT in all our server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.

Smart Crises Management and Protection (SCMP)

SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.

Dual ROM Architecture

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

Spécifications

Dimensions (WxHxD, mm)

2U
438 x 87.5 x 850

Motherboard

MDG5-GU0

CPU

AMD EPYC^™ 9006 SP7 Server processors

Single processor, PPT up to 600 W

Socket

1 x LGA 7536
Socket SP7

Chipset

Integrated into SoC

Memory

16 x DIMM slots
Support DDR5 RDIMM/MRDIMM^[1]
16-Channel memory per processor

RDIMM: Up to 8000 MT/s
MRDIMM: Up to 12800 MT/s

^[1]MRDIMMs are supported only on select CPU SKUs.

LAN

Rear (LAN board):
2 x 1 Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

Rear (DC-SCM):
1 x Management LAN

Video

Integrated in ASPEED^® AST2700
- 1 x Mini-DP

Storage

Front hot-swap:
20 x E3.S Gen6 NVMe

Internal M.2:
2 x M.2 (2280/22110), PCIe Gen4 x2

PCIe Expansion Slots

PCIe Cable:
1 x FHFL x16 (Gen6 x16)

Front I/O

2 x USB 3.2 Gen1 port (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

LAN board:
2 x RJ45 ports

DC-SCM:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x Debug port (Type-C)
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Security Modules

2 x TPM headers with SPI interface
- Optional TPM 2.0 kit: CTM012

Power Supply^[#1]

2 x 3200 W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 100-127V~, 16A, 50-60Hz
- 200-220V~, 16A, 50-60Hz
- 220-240V~, 16A, 50-60Hz

DC Input: (Only for China)
- 240Vdc, 16A

DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

^[Note]GIGABYTE offers PSUs with various efficiency ratings and power outputs. Full redundancy may depend on your server configuration, and alternative PSU options may be needed. Please contact our sales representatives for the best power solution.

System Fans

4 x 80x80x80mm

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Packaging Dimensions

1122 x 685 x 305 mm

Packaging Content

1 x R265-DG3-AS1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR265DG3HR000AS1*
- Motherboard: 9MDG5GU0IR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-Q3JH01-K0R
- Front panel board - CFP2003: 9CFP2003NR-00*
- Backplane board - CBP20P1: 9CBP20P1NR-00*
- DC-SCM - CDCR342: 9CDCR342NR-00*

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A5JH00-K0R
- Cable Management Arm: 25HB2-2AA700-K0R

[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.

[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#4] All trademarks and logos are the property of their respective owners.

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