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Serverの比較結果
- クイックナビ
- Dimensions (WxHxD, mm)
Dimensions
(WxHxD, mm)4U
447 x 175.5 x 9014U
447 x 175.5 x 901- Motherboard
Motherboard
MSB3-PE0MSB4-PE0- CPU
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.Intel® Xeon® 6 Processors
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.- Socket
Socket
2 x LGA 4677
Socket E2 x LGA 4710
Socket E2- Chipset
Chipset
Intel® C741System on Chip- Memory
Memory
32 x DIMM slots
Support DDR5 RDIMM
8-Channel memory per processor
5th Gen Intel® Xeon®:
Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®:
Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.- LAN
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.Front (I/O board):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.- Video
Video
Integrated in ASPEED® AST2600
- 1 x VGA portIntegrated in ASPEED® AST2600
- 1 x VGA port- Storage
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x2, from PCH
1 x M.2 (2280/22110), PCIe Gen3 x1, from PCHFront hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1- SAS
SAS
N/A- RAID
RAID
Intel® SATA RAID 0/1/10/5- Modular GPU
Modular GPU
Liquid-cooled NVIDIA HGX™ B200 with 8 x SXM GPUsLiquid-cooled NVIDIA HGX™ B200 with 8 x SXM GPUs- PCIe Expansion Slots
PCIe Expansion Slots
PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
[Note] The ambient temperature is limited to 30°C when NVIDIA® BlueField®-3 DPUs/SuperNIC™ are installed.8 x FHHL x16 (Gen5 x16), from PEX89104
4 x FHHL x16 (Gen5 x16), from PEX89048
[Note] The ambient temperature is limited to 30°C when NVIDIA® BlueField®-3 DPUs/SuperNIC™ are installed.- Front I/O
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LEDI/O board:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED- Rear I/O
Rear I/O
MLAN board - CDB66:
1 x MLAN portMLAN board:
1 x MLAN port- Backplane Board
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s- Security Modules
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM0121 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012- Power Supply
Power Supply
4+4 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.4+4 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.- System Management
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
- System Fans
System Fans
Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm
GPU tray:
4 x 60x60x38mmMotherboard:
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm
GPU tray:
4 x 60x60x38mm- Operating Properties
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.- Packaging Dimensions
Packaging Dimensions
1300 x 800 x 439 mm1300 x 800 x 444 mm- Packaging Content
Packaging Content
1 x G4L3-SD1-LAX5
6 x Carriers
1 x L-shape Rail kit1 x G4L4-SD1-LAX5
4 x Carriers
1 x L-shape Rail kit- Part Numbers
Part Numbers
- Barebone with NVIDIA module: 6NG4L3SD1DR000LBX5*
- Motherboard: 9MSB3PE0UR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CoolIT CPU cold plate loop: 25ST7-10000I-C4R
- CoolIT GPU cold plate loop: 25ST7-3000ZF-C4R/25ST7-3000ZG-C4R
- CoolIT NVSwitch cold plate loop: 25ST7-3000ZE-C4R
- Front panel board - CFPG540: 9CFPG540NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*
- Fan module 60x60x38mm: 25ST2-663830-F1R
- Fan module 60x60x38mm: 25ST2-663831-F1R
- Fan module 60x60x56mm: 25ST2-665623-S1R
- Fan module 60x60x76mm: 25ST2-667621-A0R
- Fan module 80x80x56mm: 25ST2-885622-A0R
- PCIe bridge board - CPBG045: 9CPBG045NR-00*
- PCIe switch board - CBG76: 9CBG76NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Leak sensor board - CNBG72: 9CNBG72NR-00*
- Power supply: 25EP0-203K01-D0S- Barebone with NVIDIA module: 6NG4L4SD1DR000LAX5*
- Motherboard: 9MSB4PE0UR-000*