H253-Z10
(rev. AAP1)

High-Density Server - AMD EPYC™ 9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe

# HPC # HCI

2U 4-Node front access server system
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor per node, 5nm technology
12-Channel RDIMM DDR5 per processor, 96 x DIMMs
Dual ROM Architecture
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
2 x CMC ports
8 x E1.S Gen4 NVMe hot-swappable bays
12 x M.2 slots with PCIe Gen5 x4 and SATA interface
4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Front access
447 x 86.8 x 902

Motherboard

MZ13-SH0

CPU

AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Socket

Per Node:
1 x LGA 6096

Total:
4 x LGA 6096

Socket SP5

Chipset

System on Chip

Memory

Per node:
24 x DIMM slots

Total:
96 x DIMM slots

DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz (1DPC), 3600 MHz (2DPC)

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports
2 x CMC ports

*Spanning Tree Protocol (STP) must be enabled in LAN switch function if using ring topology.

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
8 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen5 x4
- Supports 2280/22110 cards

2 x M.2 slots:
- M-key
- SATAIII via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1

Total:
Riser Card CRSH01Q x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

4 x M.2 slots:
- M-key
- PCIe Gen5 x4
- Support 2280/22110 cards

8 x M.2 slots:
- M-key
- SATAIII via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1

Internal I/O

Per node:
1 x COM
1 x TPM header

Front I/O

Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons

Rear I/O

2 x CMC ports

Backplane Board

N/A

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input:
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12Vsb/ 3A
- Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+ 12.2V/ 245A
+ 12Vsb/ 3A

Note: The system power supply requires C19 power cord

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 29.4 kg
Gross Weight: 46.8 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H253-Z10
4 x CPU heatsinks
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH253Z10DR000AAP1*
- Motherboard: 9MZ13SH0UR-000
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-553202-A0R
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- EDSFF Riser card - CRSH01X: 9CRSH01XNR-00
- CMC module - CMBH42: 9CMBH42NR-00
- Power Supply: 25EP0-23000H-G1S

Optional parts:

- E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NH253Z10SR-RMA-A100

SUPPORT

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Chipset

バージョン

サイズ

日付

AMD Chipset Driver

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

H253-Z10 (rev. AAP1)

SPECIFICATIONS

SUPPORT

RESOURCES

H253-Z10 (rev. AAP1)

H253-Z10
(rev. AAP1)