TO46-ZX1-LA04

ORV3 GPU Server - AMD EPYC™ 9005/9004 Server Processors - 4OU, DP, AMD Instinct™ MI355X, DLC
  • Liquid-cooled 8 x AMD Instinct™ MI355X OAM GPUs
  • CPU+GPU direct liquid cooling solution with leak detection
  • Dual AMD EPYC™ 9005/9004 Server processors
  • 12-Channel liquid-cooled DDR5 RDIMM per CPU with 24 x DIMMs
  • 2 x 10 Gb/s LAN ports via Intel® X710-AT2
  • 2 x M.2 slots with PCIe Gen3 x4 and x1
  • 8 x 2.5" Gen5 NVMe hot-swap bays
  • 4 x FHHL PCIe x16 slots with Gen5 x16 lanes
  • 8 x LP PCIe x16 slots with Gen5 x16 lanes
  • 48 V to 54 V DC Bus Bar power solution
Ordering Numbers: 6NTO46ZX1DR000LC04*
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New AMD EPYC™ Family of Processors
 Same Great SP5 Platform

The SP5 socket has reached its pinnacle form with 5th Generation AMD EPYC™ processors. The same successful platform that was shared by AMD EPYC™ 9004 & 8004 server processors is now the same one for AMD EPYC™ 9005 server processors. With up to 192 cores, increased frequencies and cache, this top tier performance platform targets general purpose, cloud native, and technical computing. Building on the advantages of the EPYC™ 9004 server, the new EPYC™ 9005 server adopts the 3nm process with AMD “Zen5” and “Zen5c” core architecture, excelling in both energy efficiency and cost optimization. GIGABYTE has already prepared for this new processor with new servers and updates to existing products for 4th Gen AMD EPYC™ processors.

5th Generation AMD EPYC™ Processors for SP5 Socket

3nm
architecture
Increased transistor density alongside a reduction in power consumption
Up to 192
CPU cores
Dedicated “Zen 5” & “Zen 5c” cores increase compute density
Up to 512MB
L3 cache
An L3 cache increase helps to reduce latency in data-intensive operations
12
channels
Memory capacity up to 9TB in a 2 DIMM per channel configuration
Up to 160
PCIe lanes
Dual socket configuration adds a significant amount of I/O connectivity
CXL 2.0
support
Disaggregated compute architecture possible via Compute Express Link
• AMD EPYC™ 9005 server processors require OEM enablement and a BIOS update from your server or motherboard manufacturer if used with a motherboard designed for the SP5 socketed AMD EPYC™ 9004 server processors. Contact your system manufacturer prior to purchase to determine compatibility.
• CXL Type 1&2 devices and PCIe link encryption support dependent upon ecosystem readiness; type 2 PoC only.
• CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the AMD EPYC™ 9005 Platform

High Performance

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads while supporting the latest GPU and CXL technology.
Compute Density

Compute Density

With 192 CPU cores per socket, GIGABYTE's 4-node servers support up to 1,536 CPU cores, allowing a far greater number of concurrent tasks to be done.
Fast & Stable Connectivity

Fast & Stable Connectivity

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for fast PCIe 5.0 speeds.
Collaboration

Collaboration

AMD and GIGABYTE have maintained a healthy relationship that values shared knowledge and open communication in order to launch products in tandem.
Optimal Price

Optimal Price

Our broad portfolio of products tailored to applications allow customers to only select server features they require while doing so at a lower TCO.

TO46-ZX1-LA04 Block Diagram

TO46-ZX1-LA04 Product Overview

Empowering Innovation, Built for Open Compute

GIGABYTE OCP ORV3 Compliant Solutions

GIGABTYE is an active member of the OCP, regularly attending the OCP's annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.

Hardware Security

Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

High Availability

Dual ROM Architecture
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

User Friendly

Tool-less Drive Bays Design

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.
Certified Ready with Software Partners

Certified Ready with Software Partners

Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.

Specificații

Dimensions (WxHxD, mm)
4OU
537 x 189.2 x 840
Motherboard
MZB3-PE1
CPU
AMD EPYC™ 9005 Server processors
AMD EPYC™ 9004 Server processors

[DLC] Dual processors, cTDP up to 500 W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Chipset
Integrated into SoC
Memory
[DLC] 24 x DIMM slots
Support DDR5 RDIMM
12-Channel memory per processor

AMD EPYC™ 9005:
Up to 6400 MT/s

AMD EPYC™ 9004:
Up to 4800 MT/s
LAN
Front (I/O board):
2 x 10 Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI

1 x Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
Modular GPU
[DLC] 8 x AMD Instinct™ MI355X OAM GPUs
PCIe Expansion Slots
PCIe Bridge Board:
- 8 x LP x16 (Gen5 x16), from PEX89104

PCIe Bridge Board x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89072

[Note] The ambient temperature is limited to 30°C when NVIDIA® BlueField®-3 DPUs/SuperNIC™ are installed.
Front I/O
I/O board:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012
System Fans
2 x 80x80x38mm
2 x 80x80x56mm
4 x 92x92x76mm
Liquid Cooling Interface
Connector type: UQD06
Blind mate: Not supported
Hose length: Not included

[Note] Requires additional server-to-manifold UQD hoses.
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
Packaging Dimensions
1300 x 800 x 460 mm
Packaging Content
1 x TO46-ZX1-LA04
1 x L-shape Rail kit
Part Numbers
- Barebone with AMD module: 6NTO46ZX1DR000LC04*
- Motherboard: 9MZB3PE1UR-000*
- L-shape Rail kit: 25HB4-DHA301-H4R
- Front panel board - CFPG540: 9CFPG540NR-00*
- Backplane board - CBPG680: 9CBPG680NR-00*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.

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