H261-Z61

‏(rev. A00)‏

2U 4-Node - Rear access
440 x 87 x 820

MZ61-HD0

AMD EPYC™ 7002 series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 200W

Compatible with AMD EPYC™ 7001 series processors

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

System on Chip

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200*/2933 MHz

Note: Follow BIOS setting and memory QVL list if running 3200 Mhz

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel^® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC port

*CMC: Chassis Management Controller, to monitor all status of computing nodes

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

Total:
8 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
16 x 2.5" SATA/SAS hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

SAS card is required for SAS devices support

Depends on SAS Add-on card

Per node:
2 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

Total:
8 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0

4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
*1 x CMC status LED

*Only one CMC status LED per system

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

2 x 2200W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE:
1) The system power supply requires C19 power cord
2) 2000W 80 PLUS Titanium power supply as an option

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

For AMD EPYC™ 7002 series processors

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP4 (x64) or later
SUSE Linux Enterprise Server 15 SP1 (x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.1.0 or later

For AMD EPYC™ 7001 series processors

Windows Server 2012 R2 with Update
Windows Server 2016

Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

35 kg (full packaging)

1167 x 700 x 309 mm

1 x H261-Z61
8 x CPU heatsinks
1 x Rail Kit

- Barebone package: 6NH261Z61MR-00-A*
- Motherboard: 9MZ61HD0NR-00-2*
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH0O0: 9CBPH0O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222001-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH23NR48SR-00 (optional)