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  4. B660M GAMING X AX DDR4

B660M GAMING X AX DDR4 (Rev. 1.x)

B660M G X AX DDR4
Key FeaturesSpecyfikacjaSupportAktualności/NagrodyWhere to Buy

Specyfikacja

  • Procesor
    1. LGA1700 socket: Support for the 14th, 13th, and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors*
    2. L3 cache varies with CPU
    * Please refer to "CPU Support List" for more information.
  • Chipset
    1. Intel® B660 Express Chipset
  • Pamięć
    1. Support for DDR4 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) /3200/3000/2933/2666/2400/2133 MHz memory modules
    2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
    3. Dual channel memory architecture
    4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
    5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    6. Support for Extreme Memory Profile (XMP) memory modules
    (Please refer "Memory Support List" for more information.)
  • Wyjścia graficzne
  • Integrated Graphics Processor-Intel® HD Graphics support:
    1. 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
      * Support for HDMI 2.1 version and HDCP 2.3.
      ** Support native HDMI 2.1 TMDS compatible ports.
    2. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
      * Support for DisplayPort 1.2 version and HDCP 2.3
    (Graphics specifications may vary depending on CPU support.)
  • Układ audio
    1. Realtek® Audio CODEC
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
      * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE's website for details on configuring the audio software.
    4. Support for S/PDIF Out
  • LAN
    1. 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
  • Wireless Communication module
  • Intel® Wi-Fi 6 AX200 (For PCB rev. 1.0)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
    Intel® Wi-Fi 6E AX211 (For PCB rev. 1.1)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
      * Actual data rate may vary depending on environment and equipment.
  • Złącza rozszerzeń
    1. 1 x PCI Express x16 slot, running at x16 (PCIEX16)
      * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
      (The PCIEX16 slot conforms to PCI Express 4.0 standard.)
    2. 1 x PCI Express x16 slot, running at x4 (PCIEX4)
      (The PCIEX4 slot conforms to PCI Express 3.0 standard.)
  • Złącza SATA
  • CPU:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
    Chipset:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
    2. 4 x SATA 6Gb/s connectors
    Support for RAID 0, RAID 1, RAID 5, and RAID 10

    Intel® Optane™ Memory Ready
    * System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connectors supported by the Chipset.
  • USB
  • Chipset:
    1. 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header
    2. 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
    3. 1 x USB 2.0/1.1 port on the back panel
    Chipset+2 USB 2.0 Hubs:
    1. 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
  • Wewnętrzne złącza wejścia/wyjścia
    1. 1 x 24-pin ATX main power connector
    2. 1 x 8-pin ATX 12V power connector
    3. 1 x CPU fan header
    4. 3 x system fan headers
    5. 2 x addressable LED strip headers
    6. 2 x RGB LED strip headers
    7. 2 x M.2 Socket 3 connectors
    8. 4 x SATA 6Gb/s connectors
    9. 1 x front panel header
    10. 1 x front panel audio header
    11. 1 x USB Type-C® header, with USB 3.2 Gen 2 support
    12. 1 x USB 3.2 Gen 1 header
    13. 2 x USB 2.0/1.1 headers
    14. 1 x S/PDIF Out header
    15. 2 x Thunderbolt™ add-in card connectors
    16. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
    17. 1 x serial port header
    18. 1 x reset button
    19. 1 x Q-Flash Plus button
    20. 1 x reset jumper
    21. 1 x Clear CMOS jumper
    ＊All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
  • Złącza wejścia/wyjścia na tylnym panelu
    1. 3 x USB 3.2 Gen 1 ports
    2. 5 x USB 2.0/1.1 ports
    3. 2 x SMA antenna connectors (2T2R)
    4. 1 x HDMI 2.1 port
    5. 1 x DisplayPort
    6. 1 x RJ-45 port
    7. 3 x audio jacks
  • Kontroler I/O
    1. iTE® I/O Controller Chip
  • Monitoring sprzętowy
    1. Voltage detection
    2. Temperature detection
    3. Fan speed detection
    4. Fan fail warning
    5. Fan speed control
      * Whether the fan speed control function is supported will depend on the fan you install.
  • BIOS
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI UEFI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Inne funkcje
    1. Support for APP Center
      * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
      @BIOS
      EasyTune
      RGB Fusion
      Smart Backup
      System Information Viewer
    2. Support for Q-Flash Plus
    3. Support for Q-Flash
    4. Support for Xpress Install
  • Bundled Software
    1. Norton® Internet Security (OEM version)
    2. LAN bandwidth management software
  • System operacyjny
    1. Support for Windows 11 64-bit
    2. Support for Windows 10 64-bit
  • Wymiary
    1. Micro ATX Form Factor; 24.4cm x 24.4cm
  • Procesor
    1. LGA1700 socket: Support for the 14th, 13th, and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors*
    2. L3 cache varies with CPU
    * Please refer to "CPU Support List" for more information.
  • Chipset
    1. Intel® B660 Express Chipset
  • Pamięć
    1. Support for DDR4 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) /3200/3000/2933/2666/2400/2133 MHz memory modules
    2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
    3. Dual channel memory architecture
    4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
    5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    6. Support for Extreme Memory Profile (XMP) memory modules
    (Please refer "Memory Support List" for more information.)
  • Wyjścia graficzne
  • Integrated Graphics Processor-Intel® HD Graphics support:
    1. 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
      * Support for HDMI 2.1 version and HDCP 2.3.
      ** Support native HDMI 2.1 TMDS compatible ports.
    2. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
      * Support for DisplayPort 1.2 version and HDCP 2.3
    (Graphics specifications may vary depending on CPU support.)
  • Układ audio
    1. Realtek® Audio CODEC
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
      * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE's website for details on configuring the audio software.
    4. Support for S/PDIF Out
  • LAN
    1. 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
  • Wireless Communication module
  • Intel® Wi-Fi 6 AX200 (For PCB rev. 1.0)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
    Intel® Wi-Fi 6E AX211 (For PCB rev. 1.1)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
      * Actual data rate may vary depending on environment and equipment.
  • Złącza rozszerzeń
    1. 1 x PCI Express x16 slot, running at x16 (PCIEX16)
      * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
      (The PCIEX16 slot conforms to PCI Express 4.0 standard.)
    2. 1 x PCI Express x16 slot, running at x4 (PCIEX4)
      (The PCIEX4 slot conforms to PCI Express 3.0 standard.)
  • Złącza SATA
  • CPU:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
    Chipset:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
    2. 4 x SATA 6Gb/s connectors
    Support for RAID 0, RAID 1, RAID 5, and RAID 10

    Intel® Optane™ Memory Ready
    * System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connectors supported by the Chipset.
  • USB
  • Chipset:
    1. 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header
    2. 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
    3. 1 x USB 2.0/1.1 port on the back panel
    Chipset+2 USB 2.0 Hubs:
    1. 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
  • Wewnętrzne złącza wejścia/wyjścia
    1. 1 x 24-pin ATX main power connector
    2. 1 x 8-pin ATX 12V power connector
    3. 1 x CPU fan header
    4. 3 x system fan headers
    5. 2 x addressable LED strip headers
    6. 2 x RGB LED strip headers
    7. 2 x M.2 Socket 3 connectors
    8. 4 x SATA 6Gb/s connectors
    9. 1 x front panel header
    10. 1 x front panel audio header
    11. 1 x USB Type-C® header, with USB 3.2 Gen 2 support
    12. 1 x USB 3.2 Gen 1 header
    13. 2 x USB 2.0/1.1 headers
    14. 1 x S/PDIF Out header
    15. 2 x Thunderbolt™ add-in card connectors
    16. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
    17. 1 x serial port header
    18. 1 x reset button
    19. 1 x Q-Flash Plus button
    20. 1 x reset jumper
    21. 1 x Clear CMOS jumper
    ＊All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
  • Złącza wejścia/wyjścia na tylnym panelu
    1. 3 x USB 3.2 Gen 1 ports
    2. 5 x USB 2.0/1.1 ports
    3. 2 x SMA antenna connectors (2T2R)
    4. 1 x HDMI 2.1 port
    5. 1 x DisplayPort
    6. 1 x RJ-45 port
    7. 3 x audio jacks
  • Kontroler I/O
    1. iTE® I/O Controller Chip
  • Monitoring sprzętowy
    1. Voltage detection
    2. Temperature detection
    3. Fan speed detection
    4. Fan fail warning
    5. Fan speed control
      * Whether the fan speed control function is supported will depend on the fan you install.
  • BIOS
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI UEFI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Inne funkcje
    1. Support for APP Center
      * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
      @BIOS
      EasyTune
      RGB Fusion
      Smart Backup
      System Information Viewer
    2. Support for Q-Flash Plus
    3. Support for Q-Flash
    4. Support for Xpress Install
  • Bundled Software
    1. Norton® Internet Security (OEM version)
    2. LAN bandwidth management software
  • System operacyjny
    1. Support for Windows 11 64-bit
    2. Support for Windows 10 64-bit
  • Wymiary
    1. Micro ATX Form Factor; 24.4cm x 24.4cm

* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Zamieszczony materiał został udostępniony jedynie w celach informacyjnych. GIGABYTE zastrzega sobie prawo do wprowadzania zmian w specyfikacji produktu i udostępnionych informacji o produkcie bez wcześniejszego powiadomienia.
* Przedstawiane dane są oparte na maksymalnych teoretycznych wydajnościach przedstawionym przez producentów chipsetów lub organizacji określających zakres tych specyfikacji. Rzeczywista wydajność może się różnić w zależności od konfiguracji systemu.
* Wszystkie znaki towarowe są własnością ich właścicieli.
* Z uwagi na budowę systemu, zakres pamięci może się różnić.

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