TO25-ZM2-LA01
ORV3 Compute Node - AMD EPYC™ 9005 Server Processors - 2OU 2-Node, UP, 16-Bay E3.S Gen5 NVMe + 2-Bay E1.S Gen3 NVMe
- Direct liquid cooling solution
- Single AMD EPYC™ 9005 Server processors
- 12-Channel DDR5 RDIMM per CPU with 12 x DIMMs
- Hardware Root of Trust
- 2 x 1 Gb/s LAN ports via Intel® I350-AM2
- 16 x E3.S Gen5 NVMe hot-swap bays
- 2 x E1.S Gen3 NVMe hot-swap bays
- 2 x LP PCIe x16 slots with Gen5 x16 lanes
- 48 V to 54 V DC bus bar power solution
المواصفات
Dimensions (WxHxD, mm)
2OU 2-Node
264 x 91 x 777
264 x 91 x 777
Open Rack Version
ORV3
Motherboard
MZN3-OP1
CPU
AMD EPYC™ 9005 Server processors
Single processor, cTDP up to 400 W
Single processor, cTDP up to 400 W
Memory
12 x DIMM slots
Support DDR5 RDIMM
12-Channel memory per processor
Up to 6400 MT/s
Support DDR5 RDIMM
12-Channel memory per processor
Up to 6400 MT/s
LAN
Front (I/O board - COFP33A):
2 x 1 Gb/s LAN (1 x Intel® I350-AM2)
1 x 10/100/1000 Mb/s Management LAN
Rear:
2 x 1 Gb/s LAN (1 x Intel® I350-AM2) (Cross-node data link)
2 x 1 Gb/s LAN (1 x Intel® I350-AM2)
1 x 10/100/1000 Mb/s Management LAN
Rear:
2 x 1 Gb/s LAN (1 x Intel® I350-AM2) (Cross-node data link)
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
- 1 x Mini-DP
Storage
Front hot-swap:
16 x E3.S Gen5 NVMe
- (PCIe Gen5 x2 per drive)
2 x E1.S Gen3 NVMe
- (PCIe Gen3 x4 shared, from SAS3808N)
16 x E3.S Gen5 NVMe
- (PCIe Gen5 x2 per drive)
2 x E1.S Gen3 NVMe
- (PCIe Gen3 x4 shared, from SAS3808N)
RAID
Supports RAID 0/1 on E1.S drives
Require RAID add-in cards
Require RAID add-in cards
PCIe Expansion Slots
PCIe Cable x 2:
- 2 x LP x16 (Gen5 x16)
- 2 x LP x16 (Gen5 x16)
Front I/O
I/O board - COFP33A+COFP340:
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x BMC reset button
1 x System status LED
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x BMC reset button
1 x System status LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012
- Optional TPM 2.0 kit: CTM012
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
System Fans
N/A
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Dimensions
1182 x 485 x 275 mm
Packaging Content
1 x TO25-ZM2-LA01
1 x CPU cold plate loop
1 x CPU cold plate loop
Part Numbers
- Barebone package: 6NTO25ZM2RRTS6LA01*
- Motherboard: 9MZN3OP1UR-000*
- CPU cold plate loop: 25ST7-20000T-A3R
- Backplane board - COBP520: 9COBP520NR-00*
- E1.S backplane board - COBP880: 9COBP880NR-00*
- E1.S backplane board - COBP881: 9COBP881NR-00*
- I/O board - COFP33A: 9COFP33ANR-00*
- I/O board - COFP340: 9COFP340NR-00*
- Motherboard: 9MZN3OP1UR-000*
- CPU cold plate loop: 25ST7-20000T-A3R
- Backplane board - COBP520: 9COBP520NR-00*
- E1.S backplane board - COBP880: 9COBP880NR-00*
- E1.S backplane board - COBP881: 9COBP881NR-00*
- I/O board - COFP33A: 9COFP33ANR-00*
- I/O board - COFP340: 9COFP340NR-00*
[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#3] All trademarks and logos are the property of their respective owners.
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