G4L4-ZD3-LAX7

HPC/AI Server - AMD EPYC 9005/9004 Server Processors - 4U DP NVIDIA HGX B300 DLC
  • Liquid-cooled NVIDIA HGX B300
  • Integrated-manifold DLC solution with leak detection
  • 8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet GPU networking ports via onboard NVIDIA ConnectX®-8 SuperNIC
  • 1.8 TB/s GPU-to-GPU bandwidth with NVIDIA NVLink and NVIDIA NVLink Switch
  • Dual AMD EPYC 9005/9004 Server Processors
  • 12-Channel DDR5 RDIMM per CPU with 24 x DIMMs
  • Compatible with NVIDIA BlueField®-3 DPUs
  • 2 x 10 Gb/s LAN ports via Intel® X710-AT2
  • 2 x M.2 slots with PCIe Gen3 x4 and x1
  • 8 x 2.5" Gen5 NVMe hot-swap bays
  • 4 x FHHL PCIe x16 slots with Gen5 x16 lanes
  • 5+5 3000 W 80 PLUS Titanium redundant power supplies
Ordering Numbers: 6NG4L4ZD3DR000LCX7*
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產品規格

Dimensions (WxHxD, mm)
4U
447 x 175.5 x 901
Motherboard
MZB3-PE3
CPU
AMD EPYC 9005 Server Processors
AMD EPYC 9004 Server Processors

[DLC] Dual processors, cTDP up to 500 W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
[DLC] 24 x DIMM slots
Support DDR5 RDIMM
12-Channel memory per processor

AMD EPYC 9005:
Up to 6400 MT/s

AMD EPYC 9004:
Up to 4800 MT/s
LAN
Front (I/O board):
2 x 10 Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Rear:
[DLC] 8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC

Rear (MLAN board):
1 x 10/100/1000 Mb/s Management LAN

[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in ASPEED® AST2600
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
Modular GPU
[DLC] NVIDIA HGX B300 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89072
Front I/O
I/O board:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
8 x OSFP ports

MLAN board:
1 x MLAN port
Security Modules
1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012
Power Supply[#1]
5+5 3000 W 80 PLUS Titanium redundant power supplies [1]

AC Input:
- 115-127V~, 14.2A, 50-60Hz
- 200-220V~, 15.8A, 50-60Hz
- 220-240V~, 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc, 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Fans
Motherboard:
2 x 60x60x38mm
3 x 60x60x56mm

PCIe slots:
2 x 80x80x56mm
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
Packaging Dimensions
1300 x 800 x 444 mm
Packaging Content
1 x G4L4-ZD3-LAX7
1 x L-shape Rail kit
Part Numbers
- Barebone with NVIDIA module: 6NG4L4ZD3DR000LCX7*
- Motherboard: 9MZB3PE3UR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- Front panel board - CFPG440: 9CFPG440NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*

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[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。

[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

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