G591-HS0

End of Support

HPC Server - 5U 32 x PCIe GPU Server
  • Supports 5G network infrastructure
  • Up to 32 x PCIe low profile GPU slots
  • Up to 8 x PCIe low profile high speed LAN connectivity slots
  • 2nd Gen. Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
  • 6-Channel RDIMM/LRDIMM DDR4, 24 x DIMMs
  • Supports Intel® Optane™ DC Persistent Memory
  • 2 x GbE LAN ports (Intel® I350-AM2)
  • 4 x 2.5" NVMe, 6 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
  • 1 x low profile PCIe Gen3 expansion slots in front side
  • 1 x OCP 2.0 Gen3 x8 mezzanine slot
  • Aspeed® AST2500 remote management controller
  • 4 x 80 PLUS Platinum 2200W redundant PSU
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產品規格

Dimensions (WxHxD, mm)
5U
447 x 219.6 x 900
Motherboard
MG61-G40
CPU
2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon®Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor

System TDP up to 205W

NOTE: If only 1 CPU is installed, some PCIe and memory functions might be unavailable
Socket
2 x LGA 3647
Socket P
Chipset
Intel® C621 Chipset
Memory
24 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 205W (Max.)
* DCPMM 256GB x12 pcs

DCPMM installation locations:
DIMM_P0_(A1, B1, C1)
DIMM_P0_(D1, E1, F1)
DIMM_P1_(G1, H1, I1)
DIMM_P1_(J1, K1, L1)

NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
LAN
2 x 1Gb/s BASE-T LAN ports (Intel® I350-AM2)
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
4 x 2.5" NVMe, 6 x 2.5" SATA/SAS hot-swappable HDD/SSD bays

SAS card is required to enable SAS devices support
SATA
Supported
SAS
N/A
RAID
For SATA drives:
Intel® SATA RAID 0/1/10/5

For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5

Note: VROC module is compatible for Intel®SSD only
Peripheral Drives
N/A
Expansion Slots
32 x PCIe x16 low profile half-lengh slots (Gen3 x16 bus) for GPUs
8 x PCIe x16 low profile half-lengh slots (Gen3 x16 bus) for LAN connectivity

1 x PCIe low profile half-lengh slots (Gen3 x8 bus) for add-on cards ( Front side)

1 x OCP 2.0 mezzanine slot ( Rear side)
- PCIe Gen3 x8
- Type1, P1, P2, P3, P4, K2, K3
Internal I/O
1 x TPM header
1 x VROC connector
1 x Front VGA header
1 x Serial header
Front I/O
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN (Primary port)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED
2 x LAN activity LEDs
Rear I/O
1 x MLAN (Reserved, enabled by jumper switch)
Backplane Board
Speed and bandwidth: SATA 6Gb/s, SAS 12Gb/s per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply[#1]
4 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
10 x 60x60x76mm (21,700rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

NOTE: Please contact Technical Support for more information about optimized GPU system operating temperature
Weight
Net Weight: 50.18 kg
Gross Weight: 60.5 kg
Packaging Content
1 x G591-HS0
2 x CPU heatsinks
1 x Rail kit
1 x VROC module
2 x Non-Fabric CPU carrier
Part Numbers
- Barebone with rail kit: 6NG591HS0MR-00
- Motherboard: 9MG61G40NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-A96100-K0R
- CPU heatsink: 25ST1-323206-A0R
- Fan module: 25ST2-667620-S0R
- Power supply: 25EP0-222003-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。

[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。

[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。

[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

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