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G894-AD3-AAX7
即將推出HPC/AI Server - Intel® Xeon® 6 Processors - 8U DP NVIDIA HGX™ B300
- NVIDIA HGX™ B300
- 8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet GPU networking ports
via onboard NVIDIA ConnectX®-8 SuperNIC™ - 1.8TB/s GPU-to-GPU bandwidth with NVIDIA NVLink™ and NVSwitch™
- Dual Intel® Xeon® 6900-Series Processors
- 12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs
- Compatible with NVIDIA® BlueField®-3 DPUs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen5 x4 and x2 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 4 x FHHL PCIe Gen5 x16 slots
- 12 x 3000W 80 PLUS Titanium redundant power supplies
產品介紹產品規格支援與下載
產品規格
Dimensions (WxHxD, mm)
8U
447 x 351 x 923
447 x 351 x 923
Motherboard
MAB4-PE2
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6900-Series Processors
Dual processor, TDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
- Intel® Xeon® 6900-Series Processors
Dual processor, TDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 7529
Socket BR
Socket BR
Chipset
System on Chip
Memory
24 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
12-Channel memory per processor
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
Support DDR5 RDIMM/MRDIMM [1]
12-Channel memory per processor
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
LAN
Front (I/O board - CFPG440):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear:
8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear:
8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in ASPEED® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
Modular GPU
NVIDIA HGX™ B300 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CPBG045 x 2:
4 x FHHL x16 (Gen5 x16), from PEX89072
4 x FHHL x16 (Gen5 x16), from PEX89072
Front I/O
I/O board - CFPG440:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
8 x OSFP ports
MLAN board - CDB66:
1 x MLAN port
MLAN board - CDB66:
1 x MLAN port
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
- Optional TPM2.0 kit: CTM012
Power Supply[#1]
12 x 3000W 80 PLUS Titanium redundant power supplies [1]
[1] The system power supply requires C19 power cord.
[1] The system power supply requires C19 power cord.
System Fans
Motherboard:
2 x 60x60x56mm
4 x 60x60x76mm
OSFP ports:
4 x 40x40x56mm
PCIe slots:
2 x 80x80x56mm
GPU tray:
15 x 80x80x80mm
2 x 60x60x56mm
4 x 60x60x76mm
OSFP ports:
4 x 40x40x56mm
PCIe slots:
2 x 80x80x56mm
GPU tray:
15 x 80x80x80mm
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1200 x 800 x 620 mm
Packaging Content
1 x G894-AD3-AAX7
2 x CPU heatsinks
2 x Carriers
1 x L-shape Rail kit
2 x CPU heatsinks
2 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NG894AD3DR000AAX7*
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[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
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