H231-G20 (rev. 100/A00)

HCI Server – Intel DP 2U 2 Nodes Server | Application: 人工智慧平台 , 高效能運算伺服器 , 超融合伺服器 & 私有雲/混和雲伺服器

Application:

人工智慧平台高效能運算伺服器超融合伺服器私有雲/混和雲伺服器

Supports up to 2 x double slot GPU cards
NVIDIA® validated GPU platform; Supports for NVIDIA® Tesla® GPUs
2U - 2 nodes with rear access to the node trays
2nd Gen. Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
4 x LGA 3647 sockets
Intel^® C621 Express Chipset
6-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
4 x 10Gb/s BASE-T LAN ports (Intel^® X550-AT2)
2 x Dedicated management ports
1 x CMC global management port
4 x 2.5" U.2, 20 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
4 x Low profile PCIe Gen3 expansion slots
2 x OCP Gen3 x16 mezzanine slots
Aspeed^® AST2500 remote management controller
2200W 80 PLUS Platinum redundant PSU
Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products

Request a Quote

加入比較表

1/6

Select All

Cancel All Download

* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 2 Nodes - Rear access
440 x 87 x 820

Motherboard

MH61-HD3

CPU

2nd Generation Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 165W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

Per Node:
2 x LGA 3647
Total:
4 x LGA 3647
Socket P

Chipset

Intel^® C621 Express Chipset

Memory

Per node:
16 x DIMM slots

Total:
32 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_( G1, J1)

NOTE:
1. 2933MHz for 2nd Generation Intel^® Xeon^® Scalable Processors only
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative

LAN

Per node:
2 x 10Gb/s BASE-T LAN ports (Intel^® X550-AT2)
1 x Dedicated management port

Total:
4 x 10Gb/s BASE-T LAN ports (Intel^® X550-AT2)
2 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Omni-Path is supported in option

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip in CMC board:
Integrated in Aspeed^® AST1250

Audio

Storage

Per node:
10 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
2 x 2.5" U.2 or SAS/SATA hot-swappable HDD/SSD bays
1 x Broadcom SAS35x24R expander
Default configuration supports:
2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
24 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
- 20 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
- 4 x 2.5" U.2 or SAS/SATA hot-swappable HDD/SSD bays
2 x Broadcom SAS35x24R expander
Default configuration supports:
4 x U.2 and 0 x SAS/SATA drives
SAS card is required to enable the drive bays

RAID

For SATA drives:
Intel® SATA RAID 0/1/5/10
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0, 1
Note: VROC module is for Intel®SSD only

Peripheral Drives

Expansion Slots

Per node:
1 x PCIe x16 slot (Gen3 x16 bus) for GPU
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
1 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
1 x OCP mezzanine slot with PCIe Gen3 x16 bus

Total:
2 x PCIe x16 slots (Gen3 x16 bus) for GPUs
2 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
2 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
2 x OCP mezzanine slot with PCIe Gen3 x16 bus

- For the latest GPU QVL, please contact your GIGABYTE representative

Internal I/O

Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
2 x Power button with LED
2 x ID button with LED
2 x Status LED
*1 x CMC status LED

*Only one CMC status LED per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED

Total:
4 x USB 3.0
2 x VGA
4 x RJ45
2 x RJ45 MLAN
2 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system

Backplane I/O

24 x ports
12Gb/s & 6Gb/s compatible
PCIe Gen3 x4 U.2 port

TPM

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

Power Supply

2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option

System Management

Aspeed^® AST2500 management controller
Avocent^® MergePoint IPMI 2.0 web interface:

Network settings
Network security settings
Hardware information
Users control
Services settings
IPMI settings
Sessions control
LDAP settings
Power control
Fan profiles
Voltages, fans and temperatures monitoring
System event log
Events management (platform events, trap settings, email settings)
Serial Over LAN
vKVM & vMedia (HTML5)

OS Compatibility

For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Weight

30 kg (full packaging)

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

NOTE: Please contact Technical Support for more information about optimized GPU system operating temperature

Packaging Dimensions

1167 X 700 X 309 mm

Packaging Content

1 x H231-G20
4 x CPU heatsinks
1 x Rail Kit
1 x VROC module
4 x Non-Fabric CPU carrier

Part Numbers

Barebone package: 6NH231G20MR-00
Spare parts:
- Motherboard: 9MH61HD3NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R
- Back plane board: 9CBPH0O0NR-00
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (in option)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (in option)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (in option)
- Ring topology kit: 6NH23NR48SR-00 (in option)

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

Choose your OS
Choose your OS
Windows Server 2019
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

2019/04/18