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H252-Z10

Rev. 100Rev. A00

HCI Server - AMD EPYC™ 7002/7001 - 2U 4-Node UP 24-Bay NVMe/SATA/SAS

超融合伺服器私有雲/混和雲伺服器

2U 4-node rear access server system
Single AMD EPYC™ 7002/7001 Series Processors per node
8-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
8 x 1Gb/s LAN ports via Intel^® I350-AM2
1 x CMC port
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
8 x M.2 slots with PCIe Gen3 x4 interface
4 x LP PCIe Gen4 x16 slots
4 x LP PCIe Gen3 x16 slots
4 x OCP 2.0 Gen3 x16 mezzanine slots
Dual 2000W 80 PLUS Platinum redundant power supply

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產品規格

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 695

Motherboard

MZ12-HD0

CPU

AMD EPYC™ 7002 Series Processors
AMD EPYC™ 7001 Series Processors
Single processor per node, 7nm technology
Up to 64 cores, 128 threads
TDP up to 225W, cTDP up to 240W

Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU

Socket

Per Node:
1 x LGA 4094

Total:
4 x LGA 4094

Socket SP3

Chipset

System on Chip

Memory

Per node:
8 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
Memory speed: Up to 3200 MT/s

LAN

Per node:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management port

Total:
8 x 1Gb/s LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x 10/100/1000 Mbps Management ports
1 x CMC port

Video

Integrated in Aspeed^® AST2500 x 4
- 4 x VGA ports

Storage

Per node:
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays

Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays

SAS

Depends on SAS add-in cards

RAID

N/A

Expansion Slots

Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Internal I/O

Per node:
1 x TPM header

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply^[#1]

Dual 2000W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A

System Management

Aspeed^® AST2500 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.1.0 or later

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP4 or later
SUSE Linux Enterprise Server 15 SP1 or later

Ubuntu 16.04.6 LTS or later
Ubuntu 18.04.3 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 25.2 kg
Gross Weight: 43.6 kg

Packaging Dimensions

1167 x 700 x 309 mm

Packaging Content

1 x H252-Z10
4 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH252Z10MR-00-1*
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S

Optional parts:

- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件)，或聯繫業務協助客製化。

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[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。

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