* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U
438 x 87.5 x 730
Motherboard
MR92-FS0
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 4189
Socket P+
Chipset
Intel® C621A Express Chipset
Memory
32 x DIMM slots
DDR4 memory supported only
8-channel memory architecture per processor
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
2 x 1Gb/s LAN ports (Intel® I350-AM2)
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
24 x 2.5" Gen4 NVMe hot-swappable HDD/SSD bays
2 x 2.5" SATA/SAS hot-swappable HDD/SSD bays in rear side
SAS
N/A
RAID
Intel® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5
Note: VROC module is compatible for Intel®SSD only
Peripheral Drives
N/A
Expansion Slots
Riser Card CRS2033:
- 1 x PCIe x16 slot (Gen4 x16), Full height half-length
- 2 x PCIe x8 slots (Gen4 x8), Full height half-length

Riser Card CRS2137:
- 1 x PCIe x16 slot (Gen4 x16 o x8), Full height half-length
- 1 x PCIe x8 slots (Gen4 x0 or x8), Full height half-length
- 1 x PCIe x16 slot (Gen4 x16 or x8), shared with OCP 2.0, Full height half-length

Riser Card CRS2027:
- 2 x PCIe x8 slots (Gen4 x8), Low profile half-length

1 x OCP 3.0 mezzanine slot with PCIe Gen4 x16 bandwidth from CPU_0
Supported NCSI function

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth from CPU_1
Supported NCSI function
Internal I/O
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x HDD back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x HDD activity LED
2 x LAN activity LEDs
Rear I/O
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane I/O
Front side_CBP20C5: 8 x SATA/SAS and 4 x SATA/SAS/NVMe ports
Rear side_CBP2022: 2 x SATA ports
Bandwidth: PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 1600W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10.0A, 50-60Hz

DC Input:
240Vdc, 10A

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W at 200-240V or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 8.2 ( x64) or later
Red Hat Enterprise Linux 8.3 ( x64) or later

SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 20.04.1 LTS (x64) or later

VMware ESXi 6.7 Update3 P03
VMware ESXi 7.0 Update2
System Fans
4 x 80x80x38mm (16'300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
982 x 588 x 268 mm
Packaging Content
1 x R282-NO0
2 x CPU heatsinks
1 x Rail kit
1 x VROC module
Part Numbers
Barebone package: 6NR282NO0MR-00
Part Numbers:
- Motherboard: 9MR92FS0NR-00
- Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-343102-M1R
- Back plane board_12-port: 9CBP20C5NR-00
- Back plane board_2-port: 9CBP2022NR-00
- Front panel board: 9CFP2001NR-00
- Power supply: 25EP0-216008-L0S
- RJ45 type COM cable: 25CR0-200400-Y4R (in option)
- Riser card - CRS2033: 9CRS2033NR-00
- Riser card - CRS2137: 9CRS2137NR-00
- Riser card - CRS2027: 9CRS2027NR-00
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

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