Storage Server - AMD EPYC™ 9005/9004 Server Processors -4U UP 60-Bay SATA/SAS with Expander + 6-Bay Gen5 NVMe + 2-Bay SATA - S463-Z30-AAB1

1/5

S463-Z30-AAB1

Rev. 1.x/3.x

Storage Server - AMD EPYC^™ 9005/9004 Server Processors -
4U UP 60-Bay SATA/SAS with Expander + 6-Bay Gen5 NVMe + 2-Bay SATA

儲存伺服器

Single AMD EPYC^™ 9005/9004 Server Processors
12-Channel DDR5 RDIMM per CPU with 24 x DIMMs
2 x 10 Gb/s LAN ports via Broadcom^® BCM57416
60 x 3.5" internal SATA/SAS hot-swap bays
2 x 2.5" SATA hot-swap bays on the rear side
6 x 2.5" Gen5 NVMe hot-swap bays on the rear side
SAS expanders with 12 Gb/s transfer speed
1 x M.2 slot with PCIe Gen4 x4
4 x LP PCIe x16 slots with Gen5 x16 lanes
3+1 800 W 80 PLUS Titanium redundant power supplies

Ordering Numbers: 6NS463Z30MR000ACB1*

加入比較表

儲存

詢價清單

New AMD EPYC™ Family of Processors
Same Great SP5 Platform

The SP5 socket has reached its pinnacle form with 5th Generation AMD EPYC™ processors. The same successful platform that was shared by AMD EPYC™ 9004 & 8004 server processors is now the same one for AMD EPYC™ 9005 server processors. With up to 192 cores, increased frequencies and cache, this top tier performance platform targets general purpose, cloud native, and technical computing. Building on the advantages of the EPYC™ 9004 server, the new EPYC™ 9005 server adopts the 3nm process with AMD “Zen5” and “Zen5c” core architecture, excelling in both energy efficiency and cost optimization. GIGABYTE has already prepared for this new processor with new servers and updates to existing products for 4th Gen AMD EPYC™ processors.

5th Generation AMD EPYC™ Processors for SP5 Socket

3nm

architecture

Increased transistor density alongside a reduction in power consumption

Up to 192

CPU cores

Dedicated “Zen 5” & “Zen 5c” cores increase compute density

Up to 512MB

L3 cache

An L3 cache increase helps to reduce latency in data-intensive operations

channels

Memory capacity up to 9TB in a 2 DIMM per channel configuration

Up to 160

PCIe lanes

Dual socket configuration adds a significant amount of I/O connectivity

CXL 2.0

support

Disaggregated compute architecture possible via Compute Express Link

• AMD EPYC™ 9005 server processors require OEM enablement and a BIOS update from your server or motherboard manufacturer if used with a motherboard designed for the SP5 socketed AMD EPYC™ 9004 server processors. Contact your system manufacturer prior to purchase to determine compatibility.

• CXL Type 1&2 devices and PCIe link encryption support dependent upon ecosystem readiness; type 2 PoC only.

• CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the AMD EPYC™ 9005 Platform

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads while supporting the latest GPU and CXL technology.

Compute Density

With 192 CPU cores per socket, GIGABYTE's 4-node servers support up to 1,536 CPU cores, allowing a far greater number of concurrent tasks to be done.

Fast & Stable Connectivity

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for fast PCIe 5.0 speeds.

Collaboration

AMD and GIGABYTE have maintained a healthy relationship that values shared knowledge and open communication in order to launch products in tandem.

Optimal Price

Our broad portfolio of products tailored to applications allow customers to only select server features they require while doing so at a lower TCO.

S463-Z30-AAB1 Block Diagram

S463-Z30-AAB1 Product Overview

Easy, Flexible & Powerful Storage Deployment

The S463-Z30 offers the following advantages to your storage deployment:

x86 architecture means compatibility with a large variety of SDS (Software Defined Storage) platforms & applications
60 x 3.5” SATA/SAS drive bays for massive scale-out capacity
Rear 6 x 2.5” Gen5 NVMe bays for ultra-high-speed cache or tiered storage
Rear 2 x 2.5” SATA drive bays for OS disks

GIGABYTE has also validated and created reference architectures for our products with various open source software defined storage systems to help make your deployment even faster and easier.

Hardware Security

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

Power Efficiency

Automatic Fan Speed Control

GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

User Friendly

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.

Certified Ready with Software Partners

Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.

High Availability

Smart Ride Through (SmaRT)

To prevent server downtime and data loss as a result of loss of AC power, GIGABYTE implements SmaRT in all our server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.

Smart Crises Management and Protection (SCMP)

SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.

Dual ROM Architecture

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

產品規格

Dimensions (WxHxD, mm)

4U
434 x 176 x 853

Motherboard

MZ33-AR1

CPU

AMD EPYC^™ 9005 Server Processors (Up to 64 cores)
AMD EPYC^™ 9004 Server Processors (Up to 84 cores)

Single processor, cTDP up to 300 W
- At 25°C ambient, cTDP up to 400 W

Socket

1 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
Support DDR5 RDIMM
12-Channel memory per processor

AMD EPYC^™ 9005:
Up to 5200 MT/s (1DPC)
Up to 4400 MT/s (1R 2DPC), 4000 MT/s (2R 2DPC)

AMD EPYC^™ 9004:
Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)

LAN

Rear:
2 x 10 Gb/s LAN (1 x Broadcom^® BCM57416)
- Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Video

Integrated in ASPEED^® AST2600
- 1 x VGA port

Storage

Internal hot-swap:
60 x 3.5" SATA/SAS^[1]

Rear hot-swap:
6 x 2.5" Gen5 NVMe
2 x 2.5" SATA

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen4 x4

^[1]Storage card is required to enable SATA and SAS drives.
- Broadcom SAS35x40 expander
- Bandwidth: SATA 6 Gb/s or SAS 12 Gb/s per port

PCIe Expansion Slots

4 x LP x16 (Gen5 x16)

Front I/O

1 x USB 3.2 Gen1 port (Type-A)
1 x Power button
1 x ID button
1 x Reset button
1 x Power LED
1 x LAN activity LED (for LAN 1)
1 x Storage activity LED (right) (disabled)
60 x Storage activity LEDs (left)
1 x System status LED 1 x ID LED

Rear I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
1 x Serial port
2 x RJ45 ports
1 x MLAN port
1 x ID LED

Security Modules

1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012

Power Supply^[#1]

3+1 800 W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~, 10A, 50/60Hz
- 200-240V~, 5A, 50/60Hz

DC Input: (Only for China)
- 240Vdc, 5A

DC Output:
- Max 800W
+12V/ 65A
+12Vsb/ 2A

OS Certifications

Red Hat Enterprise Linux 9.4 or later

System Fans

4 x 80x80x38mm

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Weight

Net Weight: 30.2 kg
Gross Weight: 35 kg

Packaging Dimensions

1200 x 800 x 439 mm

Packaging Content

1 x S463-Z30-AAB1
1 x CPU heatsink
1 x Rail kit

Part Numbers

- Barebone package: 6NS463Z30MR000A(CB1*/AB1*)
- Motherboard: 9MZ33AR1MR-000*

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件)，或聯繫業務協助客製化。

[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。

[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。

[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

支援與下載

描述	版本	檔案大小	日期