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GIGABYTE Technology, a global leader in high-performance computing, is proud to introduce the new AMD Socket AM5 X870E AORUS X3D motherboards to the North American market. Built to harness the power of AMD Ryzen™ 9000, 8000, and 7000 Series processors, these boards combine breakthrough AI-driven performance, robust thermal design, and ease of installation — delivering an unparalleled PC building and gaming experience.

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Next-Level Gaming and Performance

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At the core of this launch is X3D Turbo Mode 2.0, an AI-powered feature that dynamically optimizes gaming workloads in real time. By leveraging a built-in AI model, gamers can see performance improvements of up to 25%, ensuring smoother, faster, and more responsive gameplay across today’s most demanding titles.

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Complementing this is D5 Bionic Corsa Technology, which pushes DDR5 speeds up to an unprecedented 9000 MT/s. Through real-time AI analysis and intelligent parameter tuning, the system maximizes stability while breaking past traditional performance limits.

The advanced 18+2+2 phases digital twin VRM solution ensures rock-solid power delivery for sustained performance under heavy workloads, while an 8-layer PCB with back drilling technology improves signal integrity and data transmission reliability.

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Intelligent Cooling and Stability

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Thermal management is a cornerstone of AORUS engineering. The VRM Thermal Armor Advanced with direct-touch heatpipe design enhances cooling efficiency in the power delivery area. The PCB Thermal Plate provides a 14% improvement in heat dissipation while reinforcing stability. Meanwhile, the patented M.2 EZ-Flex design ensures SSDs remain cool and stable, even under intense usage.

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Builder-Friendly Innovation

The new motherboards feature multiple “EZ” solutions to streamline installation and upgrades:

• DriverBIOS with pre-installed Wi-Fi drivers for instant connectivity.
• PCIe EZ-Latch Plus Duo for quick, screwless GPU release.
• Rear EZ-Button for easy access to system controls like Power, Reset, and Clear CMOS.
• Wi-Fi EZ-Plug for secure antenna connections without hassle.

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Smarter BIOS and Diagnostics

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UC BIOS 2.0 introduces user-centric upgrades including one-click screenshots, quick search, and simplified navigation. Coupled with Smart 80 Port Diagnostics, builders can monitor POST codes and thermal conditions in real time, simplifying troubleshooting and system tuning.

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Future-Proof Connectivity

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Connectivity highlights include dual USB4 Type-C ports with DisplayPort Alt mode, front panel Quick Charge USB delivering 65W power, and HDMI output for flexible display setups. Networking is equally advanced, with 10GbE + 5GbE LAN and Wi-Fi 7 featuring high-gain directional antennas for ultra-fast and reliable performance.

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Availability in North America

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The GIGABYTE X870E AORUS X3D motherboards are now available through leading North American retailers and e-tailers including Amazon, Newegg, Micro Center, and Canada Computers. Enthusiasts and gamers can purchase today to unlock the full potential of AMD Ryzen X3D processors with AI-powered performance and next-gen connectivity.

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For more details, visit the official GIGABYTE website: www.gigabyte.com/Motherboard/AMD-Series.

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