Motherboard - AMD EPYC™ 9006 SP7 Server Processors - CEB UP - MD25-CG0

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MD25-CG0

Rev. 1.x

Motherboard - AMD EPYC^™ 9006 SP7 Server Processors - CEB UP

Single AMD EPYC^™ 9006 SP7 Server processors
16-Channel DDR5 RDIMM/MRDIMM per CPU with 16 x DIMMs
2 x 1 Gb/s LAN ports via Intel^® I350-AM2
6 x MCIO 8i connectors supporting PCIe Gen6 x8
1 x SlimSAS 4i connector supporting SATA
2 x M.2 slots with PCIe Gen4 x2
3 x PCIe x16 slots with Gen6 x16 lanes

Características principales

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6th Generation AMD EPYC™ Processors for SP7 Socket

DDR5 channels

Delivering up to 1.6TB/s memory bandwidth in 1DPC (MRDIMMs)

Up to 256

CPU cores

More VMs per rack and more tasks done with less real estate

Zen6 & Zen6c

Cores

Optimized core package to achieve high frequency or high density

CXL 3.1

Support

Multi-host memory sharing and P2P over fabric at double data rate

PCIe Gen6

Lanes

2x per-lane bandwidth vs Gen5, for next-gen GPUs, NICs, and storage

2nm

Architecture

Smaller process node boosts core density and efficiency per watt

Select GIGABYTE for the AMD EPYC™ 9006 Platform

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads such as high frequency training and scientific simulation.

Advanced Cooling

GIGABYTE's cooling solutions utilize diverse technologies and system designs, purpose built to keep demanding workloads performing at their peak.

Fast and Stable Connectivity

Keeping pace with the challenges for next gen technology, GIGABYTE boards provide users the signal integrity for PCIe 6.0 speeds and I/O flexibility.

Optimal Price

A broad portfolio tailored to specific applications lets customers select only the features a workload needs, keeping total cost of ownership down.

Memory Bandwidth

GIGABYTE boards support the maximum 32-channel DDR5 subsystem EPYC 9006 offers running at up to 12800 MT/s (MRDIMMs). Expertly crafted layouts ensure bandwidth remains stable under heavy workloads.

MD25-CG0 Block Diagram

MD25-CG0 Product Overview

Hardware Security

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

High Availability

Dual ROM Architecture

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

Especificación

Form Factor (WxD, mm)

CEB
304.8 x 276.7

CPU

AMD EPYC^™ 9006 SP7 Server processors

Single processor, PPT up to 600 W

Socket

1 x LGA 7536
Socket SP7

Chipset

Integrated into SoC

Memory

16 x DIMM slots
Support DDR5 RDIMM/MRDIMM^[1]
16-Channel memory per processor

RDIMM: Up to 8000 MT/s
MRDIMM: Up to 12800 MT/s

^[1]MRDIMMs are supported only on select CPU SKUs.

LAN

2 x 1 Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI

1 x Management LAN

Video

Integrated in ASPEED^® AST2700
- 1 x VGA port

Audio

N/A

Storage Interface

MCIO:
6 x MCIO 8i for 12 x Gen6 NVMe

SlimSAS:
1 x SlimSAS 4i for 4 x SATA

M.2:
2 x M.2 (2280/22110), PCIe Gen4 x2

PCIe Expansion Slots

Slot_4: PCIe x16 (Gen6 x16)
Slot_2: PCIe x16 (Gen6 x16)
Slot_1: PCIe x16 (Gen6 x16)

6 x MCIO 8i (Gen6 x8)

Internal I/O

1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
2 x 6-pin ATX 12V power connectors
1 x 12V 2x6+12SB PICPWR connector (for backplane board)
1 x 4-pin CPU fan header
1 x 3-pin CPU fan header
3 x 4-pin system fan headers
1 x USB 3.2 Gen1 x2 header
1 x USB 2.0 header (for backplane board)
1 x Leak sensor header
1 x Case intrusion header
2 x M.2 slots
6 x MCIO 8i connectors
1 x SlimSAS 4i connector
1 x NCSI connector
1 x Front panel header
1 x PMBus connector
1 x IPMB connector
1 x TPM header

Rear I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
1 x Serial port
2 x RJ45 ports
1 x MLAN port
1 x ID button with LED

Security Modules

1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012

PSU Connectors

1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
2 x 6-pin ATX 12V power connectors

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Retail Packaging Content

1 x MD25-CG0
1 x I/O shield
1 x SlimSAS 4i to 4 x SATA cable (600 mm)

Single Box dimensions: 360 x 330 x 80 mm
Carton dimensions: 674 x 424 x 385 mm
Quantity: 10 x single boxes in one carton

Bulk Packaging Content

10 x MD25-CG0
10 x I/O shields

Carton dimensions: 600 x 473 x 495 mm

Reference Numbers

Retail: 9MD25CG0HR-000-1*
Bulk: 9MD25CG0IR-000-1*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.