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  4. S12-P10R

S12-P10R (Rev. 1.0)

Características principalesEspecificaciónSoporte y DescargasWhere to Buy

Especificación

  • Procesador
    1. 1st and 2nd Generation Intel® Xeon® Scalable Processors, Dual LGA 3647 Socket P (Square) with 2 UPI support of up to 10.4 GT/s, CPU TDP support up to 165W
  • Chipset
    1. Intel® C621 Chipset
  • Memoria
    1. 8 x DDR4 DIMM sockets supporting up to 1 TB of system memory
    2. 8 channel memory architecture (4 channel per CPU)
    3. Support for DDR4 2666 MHz memory modules if using a Skylake CPU
    4. Support for DDR4 2933 MHz memory modules if using a Cascade lake CPU
    5. Support for ECC RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS memory modules
  • Gráficos Integrados
  • ASPEED® AST2500:
    1. 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
  • LAN
    1. 1 x Realtek® RTL8211E chip (10/100/1000 Mbit) (LAN1)
    2. 2 x Intel® 210AT GbE LAN chips (10/100/1000 Mbit) (LAN2, LAN3)
  • Puertos de Expansión
    1. 2 x PCI Express x16 slots, running at x16 (PCIEX16_3, PCIEX16_5)
    2. 1 x PCI Express x16 slot, running at x8 (PCIEX8_1)
    3. 2 x PCI Express x8 slots, running at x8 (PCIEX8_2, PCIEX8_6)
    4. 1 x PCI Express x8 slot, running at x4 (PCIEX4_4)
      (All of the PCI Express x16 slots conform to PCI Express 3.0 standard.)
    5. Riser Card GC-R1UA-1P8:
      1 x PCIe x8 slot (Gen3 x8) Full-Height Half-Length
  • Interfaz de Almacenamiento
    1. Front Side: 10 x 2.5” SATA hot-swappable HDD bays (Onboard)
    2. Front Side (Option): 10 x 2.5” SAS hot-swappable HDD bays (Add-in SAS HBA Card)
  • USB
  • Chipset:
    1. 5 x USB 3.1 Gen 1 ports (2 ports on the back panel, 1 port onboard, 2 ports available through the internal USB header)
    2. 2 x USB 2.0/1.1 ports available through the internal USB header
  • Conectores Internos de E/S
    1. 1 x 24-pin ATX main power connector
    2. 2 x 8-pin ATX 12V power connectors
    3. 2 x CPU fan headers
    4. 6 x system fan headers
    5. 1 x M.2 Socket 3 connector
    6. 10 x SATA 6Gb/s connectors
    7. 2 x SATA DOM power headers
    8. 1 x PMBus connector
    9. 1 x Intel® VROC Upgrade Key header
    10. 1 x front panel header
    11. 1 x USB 3.1 Gen 1 header
    12. 1 x USB 3.1 Gen 1 port
    13. 1 x USB 2.0/1.1 header
    14. 1 x Trusted Platform Module (TPM) header
    15. 1 x serial port connector
    16. 1 x chassis intrusion header
    17. 3 x SATA SGPIO headers
    18. 1 x SMD_VMD header
    19. 1 x IPMB connector
    20. 1 x SMB connector
    21. 1 x wake on LAN header
    22. 1 x Clear CMOS jumper
    23. 1 x VGA jumper
    24. 1 x Watch-Dog timer jumper
    25. 1 x VRM SMB Clock jumper
    26. 1 x VRM SMB Data jumper
    27. 1 x UID button
    28. 1 x buzzer
  • Conectores del Panel Trasero
    1. 1 x D-Sub port
    2. 3 x RJ-45 ports
    3. 2 x USB 3.1 Gen 1 ports
  • Controlador de E/S
    1. ASPEED® AST2500 BMC chip
  • Power Supply
    1. 2 x 650W Redundant PSUs + 1 x Power Distribution Board
    2. 80 PLUS Platinum
    3. AC Input: 100-240V~/ 7.8-3.8A, 50-60Hz
    4. DC Input: 180-300V~/ 4.5A
    5. DC Output:
      Max 650W/ 100-240V~
      +12V/ 54.0A (Follow PSU)
      +5Vsb/ 3A (Follow PSU)
      +5V/ 18A (Follow PDB)
      +3.3Vsb/ 15A (Follow PDB)
  • BIOS
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Operating Properties
    1. Operating temperature: 10°C to 35°C
    2. Operating humidity: 8 - 80%
    3. Non-operating temperature: -40°C to 60°C
    4. Non-operating humidity: 5% - 95%
  • Dimension
    1. 1U
    2. 438.5mm (W) x 43.5mm (H) x 660mm (D)
  • Procesador
    1. 1st and 2nd Generation Intel® Xeon® Scalable Processors, Dual LGA 3647 Socket P (Square) with 2 UPI support of up to 10.4 GT/s, CPU TDP support up to 165W
  • Chipset
    1. Intel® C621 Chipset
  • Memoria
    1. 8 x DDR4 DIMM sockets supporting up to 1 TB of system memory
    2. 8 channel memory architecture (4 channel per CPU)
    3. Support for DDR4 2666 MHz memory modules if using a Skylake CPU
    4. Support for DDR4 2933 MHz memory modules if using a Cascade lake CPU
    5. Support for ECC RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS memory modules
  • Gráficos Integrados
  • ASPEED® AST2500:
    1. 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
  • LAN
    1. 1 x Realtek® RTL8211E chip (10/100/1000 Mbit) (LAN1)
    2. 2 x Intel® 210AT GbE LAN chips (10/100/1000 Mbit) (LAN2, LAN3)
  • Puertos de Expansión
    1. 2 x PCI Express x16 slots, running at x16 (PCIEX16_3, PCIEX16_5)
    2. 1 x PCI Express x16 slot, running at x8 (PCIEX8_1)
    3. 2 x PCI Express x8 slots, running at x8 (PCIEX8_2, PCIEX8_6)
    4. 1 x PCI Express x8 slot, running at x4 (PCIEX4_4)
      (All of the PCI Express x16 slots conform to PCI Express 3.0 standard.)
    5. Riser Card GC-R1UA-1P8:
      1 x PCIe x8 slot (Gen3 x8) Full-Height Half-Length
  • Interfaz de Almacenamiento
    1. Front Side: 10 x 2.5” SATA hot-swappable HDD bays (Onboard)
    2. Front Side (Option): 10 x 2.5” SAS hot-swappable HDD bays (Add-in SAS HBA Card)
  • USB
  • Chipset:
    1. 5 x USB 3.1 Gen 1 ports (2 ports on the back panel, 1 port onboard, 2 ports available through the internal USB header)
    2. 2 x USB 2.0/1.1 ports available through the internal USB header
  • Conectores Internos de E/S
    1. 1 x 24-pin ATX main power connector
    2. 2 x 8-pin ATX 12V power connectors
    3. 2 x CPU fan headers
    4. 6 x system fan headers
    5. 1 x M.2 Socket 3 connector
    6. 10 x SATA 6Gb/s connectors
    7. 2 x SATA DOM power headers
    8. 1 x PMBus connector
    9. 1 x Intel® VROC Upgrade Key header
    10. 1 x front panel header
    11. 1 x USB 3.1 Gen 1 header
    12. 1 x USB 3.1 Gen 1 port
    13. 1 x USB 2.0/1.1 header
    14. 1 x Trusted Platform Module (TPM) header
    15. 1 x serial port connector
    16. 1 x chassis intrusion header
    17. 3 x SATA SGPIO headers
    18. 1 x SMD_VMD header
    19. 1 x IPMB connector
    20. 1 x SMB connector
    21. 1 x wake on LAN header
    22. 1 x Clear CMOS jumper
    23. 1 x VGA jumper
    24. 1 x Watch-Dog timer jumper
    25. 1 x VRM SMB Clock jumper
    26. 1 x VRM SMB Data jumper
    27. 1 x UID button
    28. 1 x buzzer
  • Conectores del Panel Trasero
    1. 1 x D-Sub port
    2. 3 x RJ-45 ports
    3. 2 x USB 3.1 Gen 1 ports
  • Controlador de E/S
    1. ASPEED® AST2500 BMC chip
  • Power Supply
    1. 2 x 650W Redundant PSUs + 1 x Power Distribution Board
    2. 80 PLUS Platinum
    3. AC Input: 100-240V~/ 7.8-3.8A, 50-60Hz
    4. DC Input: 180-300V~/ 4.5A
    5. DC Output:
      Max 650W/ 100-240V~
      +12V/ 54.0A (Follow PSU)
      +5Vsb/ 3A (Follow PSU)
      +5V/ 18A (Follow PDB)
      +3.3Vsb/ 15A (Follow PDB)
  • BIOS
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Operating Properties
    1. Operating temperature: 10°C to 35°C
    2. Operating humidity: 8 - 80%
    3. Non-operating temperature: -40°C to 60°C
    4. Non-operating humidity: 5% - 95%
  • Dimension
    1. 1U
    2. 438.5mm (W) x 43.5mm (H) x 660mm (D)

* Los términos HDMI, HDMI High-Definition Multimedia Interface (Interfaz multimedia de alta definición), HDMI Trade Dress (diseño e imagen comercial HDMI) y los logotipos HDMI son marcas comerciales o marcas registradas de HDMI Licensing Administrator, Inc.
* Todos los materiales aquí provistos son solo para referencia. GIGABYTE se reserva el derecho de modificar o revisar el contenido a cualquier hora sin aviso alguno.
* Todas las marcas y logos son propiedad de sus propios dueños.
* Debido a la arquitectura estándar de la PC, cierta cantidad de memoria es reservada para uso del sistema y actualmente la memoria disponible es menor a la mencionada.

Soporte y Descargas