| Description | Version | Size | Date |
|---|
1/6
GS-R22PDPLegacy | Firmware updates supported
2U 4 Nodes High Density Rack Server
- 2U - 4 nodes high density rack with front access to the node trays
- Intel® Xeon® processor E5-2600 & 2600 V2 product families
- 8 x LGA 2011 sockets
- Intel® C602 chipset
- 64 x DDR3 ECC slots
- 8 x GbE LAN ports (Intel® I350-AM2)
- 16 x 2.5” hot-swappable HDD/SSD bays
- 1200W 80 PLUS Platinum redundant PSU
- Overview
- Specifications
- Support
- Related Resources
Specifications
Dimensions (WxHxD, mm)
2U
447 x 87.2 x 780
447 x 87.2 x 780
Motherboard
GA-7PTSH
Mounted in front-access drawers
Mounted in front-access drawers
CPU
Supports:
- Intel® Xeon® E5-2600 V2 processors
- Intel® Xeon® E5-2600 processors
Socket
Per node:
2 x LGA 2011
Total:
8 x LGA 2011
Mounting pitch: square ILM (80x80mm)
Max. length of M4 screw threads: 3.7mm
Screws longer than 3.7mm might damage the motherboard
2 x LGA 2011
Total:
8 x LGA 2011
Mounting pitch: square ILM (80x80mm)
Max. length of M4 screw threads: 3.7mm
Screws longer than 3.7mm might damage the motherboard
Chipset
Per node:
Intel® C602
Intel® C602
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
Quad channel memory architecture
ECC & non-ECC UDIMM/RDIMM modules supported
Single and dual rank UDIMM modules up to 8GB supported
Single, dual and quad rank RDIMM modules up to 32GB supported
1.35V modules: 1066/1333/(1600*) MHz
1.5V modules: 1066/1333/1600/(1866*) MHz
*Supported by Intel® Xeon® E5-2600 V2 processors only
Download the detailed memory configuration table for the E5-1600/2600 V2 processors
Download the detailed memory configuration table for the E5-1600/2600 processors
16 x DIMM slots
Total:
64 x DIMM slots
Quad channel memory architecture
ECC & non-ECC UDIMM/RDIMM modules supported
Single and dual rank UDIMM modules up to 8GB supported
Single, dual and quad rank RDIMM modules up to 32GB supported
1.35V modules: 1066/1333/(1600*) MHz
1.5V modules: 1066/1333/1600/(1866*) MHz
*Supported by Intel® Xeon® E5-2600 V2 processors only
Download the detailed memory configuration table for the E5-1600/2600 V2 processors
Download the detailed memory configuration table for the E5-1600/2600 processors
LAN
Per node:
Dual GbE LAN ports (Intel® I350-AM2)
1 x 10/100 management LAN
Dual GbE LAN ports (Intel® I350-AM2)
1 x 10/100 management LAN
Video
Per node:
Integrated in Aspeed® AST2300
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Integrated in Aspeed® AST2300
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Per node:
4 x 2.5" hot-swappable HDD/SSD bays
Total:
16 x 2.5" hot-swappable HDD/SSD bays
4 x 2.5" hot-swappable HDD/SSD bays
Total:
16 x 2.5" hot-swappable HDD/SSD bays
SATA
Per node:
2 x SATA III 6Gb/s ports
4 x SATA II 3Gb/s ports
Total:
8 x SATA III 6Gb/s ports
16 x SATA II 3Gb/s ports
2 x SATA III 6Gb/s ports
4 x SATA II 3Gb/s ports
Total:
8 x SATA III 6Gb/s ports
16 x SATA II 3Gb/s ports
SAS
SAS ports available via Intel® upgrade ROM
RAID
Intel® SATA RAID 0/1/5/10
Peripheral Drives
-
Expansion Slots
Per node:
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector
1 x Mezzanine I/F PCIe x8 (Gen3 x8 bus) connector
Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors
4 x Mezzanine I/F PCIe x8 (Gen3 x8 bus) connectors
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector
1 x Mezzanine I/F PCIe x8 (Gen3 x8 bus) connector
Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors
4 x Mezzanine I/F PCIe x8 (Gen3 x8 bus) connectors
Internal I/O
Per node:
2 x 18-pin power connectors
1 x Front panel header
1 x CMOS battery
2 x SATA III 6Gb/s ports
4 x SATA II 3Gb/s ports
1 x SATA SGPIO header
1 x USB 2.0 header
1 x LPC header
2 x 18-pin power connectors
1 x Front panel header
1 x CMOS battery
2 x SATA III 6Gb/s ports
4 x SATA II 3Gb/s ports
1 x SATA SGPIO header
1 x USB 2.0 header
1 x LPC header
Front I/O
Per node:
2 x USB 2.0
1 x Serial
1 x Power button with LED
1 x ID button with LED
Total:
8 x USB 2.0
4 x Serial
4 x Power buttons with LED
4 x ID buttons with LED
2 x USB 2.0
1 x Serial
1 x Power button with LED
1 x ID button with LED
Total:
8 x USB 2.0
4 x Serial
4 x Power buttons with LED
4 x ID buttons with LED
Rear I/O
Per node:
2 x USB 2.0
1 x Serial
1 x VGA
3 x RJ45
Total:
8 x USB 2.0
4 x Serial
4 x VGA
12 x RJ45
2 x USB 2.0
1 x Serial
1 x VGA
3 x RJ45
Total:
8 x USB 2.0
4 x Serial
4 x VGA
12 x RJ45
Backplane Board
N/A
TPM
1 x TPM header
Power Supply[#1]
2 x 1200W redundant PSU
80 PLUS Platinum
100~230V AC
80 PLUS Platinum
100~230V AC
System Management
Aspeed® AST2300 management controller
Avocent® MergePoint IPMI 2.0 web interface:
Avocent® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (launch, configuration)
OS Compatibility
Windows Server 2008 SP2 (x86/x64)
Windows Server 2008 R2 SP1 (x64)
Red Hat Enterprise Linux 6.2 (x86/x64)
SUSE Linux Enterprise Server 11.2 (x86/x64)
VMware ESXi 5.0 / 5.1 / 5.1 U1 / 5.1 U2
Windows Server 2008 R2 SP1 (x64)
Red Hat Enterprise Linux 6.2 (x86/x64)
SUSE Linux Enterprise Server 11.2 (x86/x64)
VMware ESXi 5.0 / 5.1 / 5.1 U1 / 5.1 U2
System Fans
16 x 40x40x56mm (23000rpm)
Operating Properties
Operating temperature: 5°C to 35°C
Non-operating temperature: 0°C to 40°C
10-80% operating humidity at 30°C
Non-operating temperature: 0°C to 40°C
10-80% operating humidity at 30°C
Weight
38kg
Part Numbers
Barebone: 6NR22PDPMR-00
Rail kit: 25HB2-A86100-K0R in option
Rail kit: 25HB2-A86100-K0R in option
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
Support
Related Resources
