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G893-ZD1- AAX5
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HPC/AI Server - AMD EPYC™ 9005/9004 - 8U DP NVIDIA HGX™ B200 8-GPU
- NVIDIA HGX™ B200 8-GPU
- 1.8TB/s GPU-to-GPU bandwidth with NVIDIA® NVSwitch™
- Dual AMD EPYC™ 9005/9004 Series Processors
- 12-Channel DDR5 RDIMM, 24 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA® BlueField®-3 DPUs and ConnectX®-7 NICs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen3 x4 and x1 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 4 x FHHL dual-slot PCIe Gen5 x16 slots
- 8 x FHHL single-slot PCIe Gen5 x16 slots
- 6+6 3000W 80 PLUS Titanium redundant power supplies
[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SPECIFICATIONS
Dimensions (WxHxD, mm)
8U
447 x 351 x 923
447 x 351 x 923
Motherboard
MZB3-PE0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
AMD EPYC™ 9005:
RDIMM: Up to 6400 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
12-Channel memory per processor
AMD EPYC™ 9005:
RDIMM: Up to 6400 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in ASPEED® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
SAS
N/A
RAID
N/A
Modular GPU
NVIDIA HGX™ B200 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply[#1]
6+6 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
2 x 60x60x56mm (24,600rpm)
4 x 60x60x76mm (21,800rpm)
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
15 x 80x80x80mm (19,600rpm)
2 x 60x60x56mm (24,600rpm)
4 x 60x60x76mm (21,800rpm)
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
15 x 80x80x80mm (19,600rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1200 x 800 x 620 mm
Packaging Content
1 x G893-ZD1-AAX5
2 x CPU heatsinks
1 x L-shape Rail kit
2 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone with NVIDIA module: 6NG893ZD1DR000ACX5*
- Motherboard: 9MZB3PE0UR-000-3*
- L-shape Rail kit: 25HB2-UM6100-K0R
- CPU heatsink: 25ST1-563400-C1R
- Front panel board - CFPG540: 9CFPG540NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*
- Fan module 60x60x56mm: 25ST2-665623-S1R
- Fan module 60x60x76mm: 25ST2-667621-A0R
- Fan module 80x80x56mm: 25ST2-885622-A0R
- Fan module 80x80x80mm: 25ST2-888038-A0R
- PCIe bridge board - CPBG045: 9CPBG045NR-00*
- PCIe switch board - CBG76: 9CBG76NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-203K01-D0S
- Motherboard: 9MZB3PE0UR-000-3*
- L-shape Rail kit: 25HB2-UM6100-K0R
- CPU heatsink: 25ST1-563400-C1R
- Front panel board - CFPG540: 9CFPG540NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*
- Fan module 60x60x56mm: 25ST2-665623-S1R
- Fan module 60x60x76mm: 25ST2-667621-A0R
- Fan module 80x80x56mm: 25ST2-885622-A0R
- Fan module 80x80x80mm: 25ST2-888038-A0R
- PCIe bridge board - CPBG045: 9CPBG045NR-00*
- PCIe switch board - CBG76: 9CBG76NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-203K01-D0S
[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
晶片組
晶片組
版本
檔案大小
日期
Chipset driver for AMD EPYC 9005/9004 series processors
Version : 6.10.07.747
31.33 MB
Jan 08, 2025
作業系統: Windows Server 2019,Windows Server 2022
AMD Chipset Windows Server PSHED Plug-in Device Driver
Version : 6.10.04.235
26.5 MB
Oct 29, 2024
作業系統: Windows Server 2022
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver and Utility
Version : 29.3.1
818.63 MB
Oct 29, 2024
作業系統: Windows Server 2019,Windows Server 2022
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 1.1.3
37.29 MB
Apr 18, 2025
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
使用手冊
說明
版本
檔案大小
日期
說明
版本
檔案大小
日期
RESOURCES
Solutions
Data Center
GIGABYTE POD Manager
Simplify POD management with GIGABYTE POD Manager - an intuitive platform for AI and HPC, offering real-time monitoring, workload orchestration, and automation.
Data Center
NVIDIA Blackwell Solutions
Discover GIGABYTE's optimized solutions built to harness the groundbreaking NVIDIA Blackwell architecture. Offering unparalleled scalability, flexibility, and performance, these solutions are tailored to accelerate AI, HPC, and GPU-driven workloads, meeting the demands of tomorrow.
Video


Video | March 25, 2025
Scale AI like never before, unmatched AI performance for hyperscalers #AI #GreenDatacenter
Ready for NVIDIA Blackwell, GIGAPOD delivers unmatched AI performance for hyperscalers. With advanced air and liquid cooling, it efficiently tackles massive workloads, ensuring peak performance and energy savings. 🌱
🌍 Sustainability Meets Power: Lower power consumption paves the way for a greener AI future.
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Scale AI like never before
#GIGABYTE #GIGABYTEgroup #GigaComputing #ServerSolutions #AIComputing #GIGAPOD #NVIDIA #NVIDIABlackwell #GreenComputing #SustainableAI
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